Patents by Inventor Martin Wurzer
Martin Wurzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11528545Abstract: A circuit includes a first biasing voltage source, a second biasing voltage source, a first resistor device coupled between the first biasing voltage source and a first terminal of the circuit, a second resistor device coupled between the second biasing voltage source and a second terminal of the circuit, a third resistor device coupled between the second biasing voltage source and a third terminal, a first capacitor coupled between the third terminal and ground, and an amplifier having an input coupled to the second terminal and an output coupled to a circuit output.Type: GrantFiled: April 28, 2021Date of Patent: December 13, 2022Assignee: Infineon Technologies AGInventors: Wilfried Florian, Niccoló De Milleri, Philipp Greiner, Andreas Wiesbauer, Martin Wurzer, Bert Zinserling
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Publication number: 20220353594Abstract: A circuit includes a first biasing voltage source, a second biasing voltage source, a first resistor device coupled between the first biasing voltage source and a first terminal of the circuit, a second resistor device coupled between the second biasing voltage source and a second terminal of the circuit, a third resistor device coupled between the second biasing voltage source and a third terminal, a first capacitor coupled between the third terminal and ground, and an amplifier having an input coupled to the second terminal and an output coupled to a circuit output.Type: ApplicationFiled: April 28, 2021Publication date: November 3, 2022Inventors: Wilfried Florian, Niccoló De Milleri, Philipp Greiner, Andreas Wiesbauer, Martin Wurzer, Bert Zinserling
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Patent number: 9673785Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.Type: GrantFiled: December 7, 2015Date of Patent: June 6, 2017Assignee: Infineon Technologies AGInventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen
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Patent number: 9591408Abstract: A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate.Type: GrantFiled: November 25, 2014Date of Patent: March 7, 2017Assignee: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer
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Patent number: 9580299Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.Type: GrantFiled: December 16, 2015Date of Patent: February 28, 2017Assignee: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer, Christian Herzum
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Patent number: 9540226Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.Type: GrantFiled: May 20, 2015Date of Patent: January 10, 2017Assignee: Infineon Technologies AGInventors: Wolfgang Klein, Martin Wurzer, Stefan Barzen, Alfons Dehe
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Publication number: 20160340173Abstract: According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a first electrode, a second electrode fixed to an anchor at a perimeter of the second electrode, and a mechanical support separate from the anchor at the perimeter of the second electrode and mechanically connected to the first electrode and the second electrode. The mechanical support is fixed to a portion of the second electrode such that, during operation, a maximum deflection of the second electrode occurs between the mechanical structure and the perimeter of the second electrode.Type: ApplicationFiled: May 20, 2015Publication date: November 24, 2016Inventors: Wolfgang Klein, Martin Wurzer, Stefan Barzen, Alfons Dehe
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Patent number: 9409763Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.Type: GrantFiled: April 4, 2012Date of Patent: August 9, 2016Assignee: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer, Christian Herzum
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Publication number: 20160096726Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.Type: ApplicationFiled: December 16, 2015Publication date: April 7, 2016Inventors: Alfons Dehe, Martin Wurzer, Christian Herzum
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Publication number: 20160087606Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.Type: ApplicationFiled: December 7, 2015Publication date: March 24, 2016Inventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen
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Patent number: 9284184Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.Type: GrantFiled: April 4, 2012Date of Patent: March 15, 2016Assignee: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer, Christian Herzum
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Patent number: 9210516Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.Type: GrantFiled: April 23, 2012Date of Patent: December 8, 2015Assignee: Infineon Technologies AGInventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen
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Patent number: 9002037Abstract: A MEMS structure includes a backplate, a membrane, and an adjustable ventilation opening configured to reduce a pressure difference between a first space contacting the membrane and a second space contacting an opposite side of the membrane. The adjustable ventilation opening is passively actuated as a function of the pressure difference between the first space and the second space.Type: GrantFiled: June 22, 2012Date of Patent: April 7, 2015Assignee: Infineon Technologies AGInventors: Alfons Dehe, Matthias Herrmann, Ulrich Krumbein, Stefan Barzen, Wolfgang Klein, Wolfgang Friza, Martin Wurzer
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Publication number: 20150078587Abstract: A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate.Type: ApplicationFiled: November 25, 2014Publication date: March 19, 2015Inventors: Alfons Dehe, Martin Wurzer
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Patent number: 8983097Abstract: A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate.Type: GrantFiled: February 29, 2012Date of Patent: March 17, 2015Assignee: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer
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Patent number: 8723277Abstract: A tunable MEMS device and a method of manufacturing a tunable MEMS device are disclosed. In accordance with an embodiment of the present invention, a semiconductor device comprises a substrate, a moveable electrode and a counter electrode. The moveable electrode or the counter electrode comprises a first region and a second region, wherein the first region is isolated from the second region, wherein the first region is configured to be tuned, wherein the second region is configured to provide a sensing signal or control a system, and wherein the moveable electrode and the counter electrode are mechanically connected to the substrate.Type: GrantFiled: February 29, 2012Date of Patent: May 13, 2014Assignee: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer, Christian Herzum, Wolfgang Klein, Stefan Barzen
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Publication number: 20130277776Abstract: A packaged MEMS device and a method of calibrating a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device comprises a carrier, a MEMS device disposed on the substrate, a signal processing device disposed on the carrier, a validation circuit disposed on the carrier; and an encapsulation disposed on the carrier, wherein the encapsulation encapsulates the MEMS device, the signal processing device and the memory element.Type: ApplicationFiled: April 23, 2012Publication date: October 24, 2013Applicant: INFINEON TECHNOLOGIES AGInventors: Christian Herzum, Martin Wurzer, Roland Helm, Michael Kropfitsch, Stefan Barzen
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Publication number: 20130264663Abstract: A MEMS device and a method of making a MEMS device are disclosed. In one embodiment a semiconductor device comprises a substrate, a moveable electrode and a counter electrode, wherein the moveable electrode and the counter electrode are mechanically connected to the substrate. The movable electrode is configured to stiffen an inner region of the movable membrane.Type: ApplicationFiled: April 4, 2012Publication date: October 10, 2013Applicant: INFINEON TECHNOLOGIES AGInventors: Alfons Dehe, Martin Wurzer, Christian Herzum
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Publication number: 20130221453Abstract: A tunable MEMS device and a method of manufacturing a tunable MEMS device are disclosed. In accordance with an embodiment of the present invention, a semiconductor device comprises a substrate, a moveable electrode and a counter electrode. The moveable electrode or the counter electrode comprises a first region and a second region, wherein the first region is isolated from the second region, wherein the first region is configured to be tuned, wherein the second region is configured to provide a sensing signal or control a system, and wherein the moveable electrode and the counter electrode are mechanically connected to the substrate.Type: ApplicationFiled: February 29, 2012Publication date: August 29, 2013Applicant: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer, Christian Herzum, Wolfgang Klein, Stefan Barzen
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Publication number: 20130223654Abstract: A MEMS structure and a method for operation a MEMS structure are disclosed. In accordance with an embodiment of the present invention, a MEMS structure comprises a substrate, a backplate, and a membrane comprising a first region and a second region, wherein the first region is configured to sense a signal and the second region is configured to adjust a threshold frequency from a first value to a second value, and wherein the backplate and the membrane are mechanically connected to the substrate.Type: ApplicationFiled: February 29, 2012Publication date: August 29, 2013Applicant: Infineon Technologies AGInventors: Alfons Dehe, Martin Wurzer