Abstract: LED modules for use in, for instance, automotive applications are provided. In one example implementation, the LED module can include a substrate. The LED module can include a plurality of chip-scale package LEDs. The plurality of chip-scale package LEDs can be arranged in a matrix on the substrate. Each chip-scale package LED can have a light emitting area that is about 80% or greater of a total area associated with the chip-scale package LED. Each chip-scale package LED can be separated from an adjacent chip-scale package LED by a gap. In some embodiments, a side coat material can be disposed in the gap.

Abstract: In a method for manufacturing a foil-like electrical connector for connecting solar cells to form modules, an insulating carrier film sheet is initially provided in a width which essentially corresponds to the width of the solar cells to be connected. Furthermore, a conductive foil sheet having a width that is matched to the carrier film is provided. In addition, comb structures as subsequent electrical connection fingers are formed. The conductive foil sheet is positioned on the carrier film with the aid of pin-shaped extensions of a transport belt or a transport roller. The carrier film is subsequently joined to the conductive foil sheet, preferably via an adhesive bond. In the next step, an insulating cover film is applied, in particular laminated.

Abstract: A method for producing a photovoltaic module having backside-contacted semiconductor cells which have contact regions provided on a contact side includes: providing a foil-type, non-conducting substrate having an at least one-sided and at least sectionally electrically conductive substrate coating on a first substrate side; placing the contact sides of the semiconductor cells on a second substrate side; implementing a local perforation which penetrates the substrate and the substrate coating, to generate openings at the contact regions of the semiconductor cells; applying a contact element to fill the openings and to form a contact point between the substrate coating on the first substrate side and the semiconductor cells on the second substrate side.

Abstract: A method for producing a photovoltaic module having backside-contacted semiconductor cells which have contact regions provided on a contact side, the method including providing a non-conducting foil-type substrate, placing the contact sides of the semiconductor cells on the substrate, implementing laser drilling which penetrates the substrate to produce openings in the contact regions of the contact sides of the semiconductor cells, depositing a contacting means on the substrate to fill the openings and to form a contacting layer extending on the substrate.

Abstract: In a method for manufacturing a foil-like electrical connector for connecting solar cells to form modules, an insulating carrier film sheet is initially provided in a width which essentially corresponds to the width of the solar cells to be connected. Furthermore, a conductive foil sheet having a width that is matched to the carrier film is provided. In addition, comb structures as subsequent electrical connection fingers are formed. The conductive foil sheet is positioned on the carrier film with the aid of pin-shaped extensions of a transport belt or a transport roller. The carrier film is subsequently joined to the conductive foil sheet, preferably via an adhesive bond. In the next step, an insulating cover film is applied, in particular laminated.