Patents by Inventor Martinus Coenen

Martinus Coenen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140247435
    Abstract: In a discharge-produced plasma source, a pair of electrodes is charged using a transmission line. In an embodiment, a pair of transmission lines may be used, connected symmetrically to the electrodes. The impedance of the transmission lines, or the total impedance of the transmission lines, is equal to that of the discharge in an embodiment. Use of a transmission line provides longer discharge pulses with more consistent potential difference.
    Type: Application
    Filed: October 23, 2012
    Publication date: September 4, 2014
    Applicant: ASML Netherlands B.V.
    Inventor: Martinus Coenen
  • Publication number: 20070040270
    Abstract: The electronic device comprises a semiconductor device (10), particularly an integrated circuit, and a carrier substrate (20) with conductive layers on the first side (21) and the second side (22), and voltage supply (62) and ground connections (61) mutually arranged according to a chessboard pattern. These connections (61,62) extend in a direct path through vertical interconnects and bumps (41,42) to bond pads at the integrated circuit, which bond pads are arranged in a corresponding chessboard pattern. As a result, an array of direct paths is provided, wherein the voltage supply connections (62) form as much as possible the coaxial center conductors of a coaxial structure.
    Type: Application
    Filed: October 1, 2004
    Publication date: February 22, 2007
    Applicant: Koninklijke Philips Electronics N.V.
    Inventor: Martinus Coenen
  • Publication number: 20070018287
    Abstract: The electronic device (100) comprises an integrated circuit (10) and a carrier substrate (20) with a bottom and top conductive layer, and is provided with voltage supply, ground and signal transmission connections. In order to enable the use of more than one supply voltage, the integrated circuit (10) is subdivided into core functionality (110) and peripheral functionality (210), and the carrier substrate (20) is subdivided into a corresponding core area (31) and peripheral area (32). The ground connections of both core and periphery are mutually coupled through an interconnect (22) in the carrier substrate (20). This interconnect is particularly a ground plane, and allows the provision of a transmission line character to the interconnects for signal transmission of the periphery.
    Type: Application
    Filed: October 1, 2004
    Publication date: January 25, 2007
    Inventor: Martinus Coenen