Patents by Inventor Martinus N. Finke

Martinus N. Finke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10123430
    Abstract: Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: November 6, 2018
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Michael T. Marczi, Paul Koep, Michiel A. de Monchy, Martinus N Finke, Brian Lewis
  • Publication number: 20100139952
    Abstract: Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.
    Type: Application
    Filed: July 2, 2009
    Publication date: June 10, 2010
    Inventors: Sanyogita Arora, Martinus N. Finke, Bawa Singh, Brian Lewis, Michael T. Marczi, Mitchell Holtzer
  • Publication number: 20080173698
    Abstract: Certain examples disclosed herein are directed to materials that are designed for use in interconnects of electrical devices such as, for example, printed circuit boards and solar cells. In certain examples, a two-step solder may be used to reduce stresses on the materials used in the production of the electrical devices.
    Type: Application
    Filed: October 17, 2007
    Publication date: July 24, 2008
    Inventors: Michael T. Marczi, Paul Koep, Michel A. de Monchy, Martinus N. Finke, Brian Lewis