Patents by Inventor Martinus P. M. Maas

Martinus P. M. Maas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making an interconnect structure
    Patent number: 7943509
    Abstract: A damascene process is described using a copper fill process to fill a trench (12). The copper fill (20) is started with a deposited seed layer which includes (5) copper and titanium. Some titanium migrates to the surface during the copper fill process. The structure is annealed in a nitrogen atmosphere which creates a self-aligned TiN barrier (24) at the surface of the copper fill (20). Air gaps (26) may be created in the same annealing process. The process may be used to form a multilayer structure.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: May 17, 2011
    Assignee: NXP B.V.
    Inventors: Roel Daamen, Robertus A. M. Wolters, Martinus P. M. Maas, Pascal Bancken, Julien M. M. Michelon
  • METHOD OF MAKING AN INTERCONNECT STRUCTURE
    Publication number: 20100029076
    Abstract: A damascene process is described using a copper fill process to fill a trench (12). The copper fill (20) is started with a deposited seed layer which includes (5) copper and titanium. Some titanium migrates to the surface during the copper fill process. The structure is annealed in a nitrogen atmosphere which creates a self-aligned TiN barrier (24) at the surface of the copper fill (20). Air gaps (26) may be created in the same annealing process. The process may be used to form a multilayer structure.
    Type: Application
    Filed: December 31, 2008
    Publication date: February 4, 2010
    Applicant: NXP, B.V.
    Inventors: Roel Daamen, Robertus A.M. Wolters, Martinus P.M. Maas, Pascal Bancken, Julien M.M. Michelon