Patents by Inventor Marty Ray Williams

Marty Ray Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7748272
    Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: July 6, 2010
    Assignee: Morgan Research Corporation
    Inventors: Michael Scott Kranz, Robert Faye Elliot, Michael Ray Whitley, Marty Ray Williams, Philip John Reiner
  • Publication number: 20080163687
    Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.
    Type: Application
    Filed: March 20, 2008
    Publication date: July 10, 2008
    Applicant: Morgan Research Corporation
    Inventors: Michael Scott Kranz, Robert Faye Elliott, Michael Ray Whitley, Marty Ray Williams, Philip John Reiner
  • Patent number: 7368312
    Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.
    Type: Grant
    Filed: October 17, 2005
    Date of Patent: May 6, 2008
    Assignee: Morgan Research Corporation
    Inventors: Michael Scott Kranz, Robert Faye Elliott, Michael Ray Whitley, Marty Ray Williams, Philip John Reiner
  • Patent number: 7239064
    Abstract: The Resettable Latching MEMS Temperature Sensor provides the capability of recording external temperature extremes without consuming electrical power. The device incorporates a thermal bimorph, contacts, latches, and actuators for device reset. The device can be designed, hardwired, or programmed to trigger at various temperature levels. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the device consumes no quiescent power. The device can be configured to close a circuit, switch an interrupt signal, or switch some other electrical trigger signal between devices at the time of a temperature extreme being reached, or it can be configured to latch and be polled at some time after the temperature limit has occurred.
    Type: Grant
    Filed: May 26, 2005
    Date of Patent: July 3, 2007
    Assignee: Morgan Research Corporation
    Inventors: Arthur Anthony Jenkins, Michael Scott Kranz, Marty Ray Williams