Patents by Inventor Martyn Dalziel

Martyn Dalziel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8115286
    Abstract: An integrated circuit (IC) device includes a lead frame having a first and a second opposing surface and a plurality of lead fingers. A first die including a signal processor is mounted on the first surface of the lead frame while a second die is mounted on the second surface of the lead frame. The second die includes at least one sensor that senses at least one non-electrical parameter and has at least one sensor output that provides a sensing signal for the parameter. The sensor output is coupled to the signal processor for processing the sensing signal.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: February 14, 2012
    Assignee: Honeywell International Inc.
    Inventors: Wenwei Zhang, Len Muslek, Jamie Boyd, Mark Nesbitt, Martyn Dalziel
  • Publication number: 20100133629
    Abstract: An integrated circuit (IC) device includes a lead frame having a first and a second opposing surface and a plurality of lead fingers. A first die including a signal processor is mounted on the first surface of the lead frame while a second die is mounted on the second surface of the lead frame. The second die includes at least one sensor that senses at least one non-electrical parameter and has at least one sensor output that provides a sensing signal for the parameter. The sensor output is coupled to the signal processor for processing the sensing signal.
    Type: Application
    Filed: October 16, 2009
    Publication date: June 3, 2010
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: WENWEI ZHANG, LEN MUSLEK, JAMIE BOYD, MARK NESBITT, MARTYN DALZIEL