Abstract: An electronic device may include conductive structures such as conductive housing structures. A high-brightness, visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers and an uppermost coloring layer on the adhesion and transition layers. At least the uppermost coloring layer may be deposited using a high impulse magnetron sputtering (HiPIMS) process. The uppermost coloring layer may include a TiCrN film, a TiCrCN film, a TiCN film, or a metal nitride film that contains Ti, Zr, Hf, or Cr. The coating may exhibit a high-brightness gold color.

Abstract: An electronic device may include conductive structures such as conductive housing structures. A high-brightness, visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers and an uppermost coloring layer on the adhesion and transition layers. At least the uppermost coloring layer may be deposited using a high impulse magnetron sputtering (HiPIMS) process. The uppermost coloring layer may include a TiCrN film, a TiCrCN film, a TiCN film, or a metal nitride film that contains Ti, Zr, Hf, or Cr. The coating may exhibit a high-brightness gold color.

Abstract: An electronic device may include conductive structures such as conductive housing structures. A high-brightness, visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers and an uppermost coloring layer on the adhesion and transition layers. At least the uppermost coloring layer may be deposited using a high impulse magnetron sputtering (HiPIMS) process. The uppermost coloring layer may include a TiCrN film, a TiCrCN film, a TiCN film, or a metal nitride film that contains Ti, Zr, Hf, or Cr. The coating may exhibit a high-brightness gold color.