Patents by Inventor Marvin Diaz

Marvin Diaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Combination back grind tape and underfill for flip chips
    Publication number: 20050126686
    Abstract: The invention provides a material that acts as both back grind tape and underfill for flip chips. The material is applied to a wafer prior to back grinding, and remains in place during singulation and as the singulated flip chips are connected to substrates. This reduces process steps and provides more protection for the chip.
    Type: Application
    Filed: December 11, 2003
    Publication date: June 16, 2005
    Inventors: Yew Cheong, Marvin Diaz, Cheong Ng