Patents by Inventor Marvin HENNIGES

Marvin HENNIGES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10025030
    Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: July 17, 2018
    Assignee: Technische Universitaet Berlin
    Inventors: Stefan Meister, Hanjo Rhee, Christoph Theiss, Aws Al-Saadi, Marvin Henniges, Muhammad Atif
  • Publication number: 20180100966
    Abstract: An optoelectronic component including an optical waveguide, an integrated optical resonator, in which the waveguide or at least a portion of the waveguide is arranged, and a heat source which can increase the temperature of the resonator during operation. A web region adjoins laterally the waveguide when viewed in the longitudinal direction of the waveguide. The web region forms a jacket portion of the waveguide and has a smaller thickness than the waveguide. The heat source is thermally connected to the waveguide by means of the web region.
    Type: Application
    Filed: April 12, 2016
    Publication date: April 12, 2018
    Applicant: Technische Universität Berlin
    Inventors: Stefan MEISTER, Hajo RHEE, Christoph THEISS, Aws AL-SAADE, Marvin HENNIGES, Muhammad ATIF
  • Publication number: 20170242191
    Abstract: The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and causes beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or causes beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s).
    Type: Application
    Filed: September 25, 2015
    Publication date: August 24, 2017
    Applicants: Technische Universität Berlin, Sicoya GmbH
    Inventors: Hanjo RHEE, Marvin HENNIGES, Stefan MERSTER, Christoph THEISS, David SELICKE, David STOLAREK, Lars ZIMMERMANN, Harald H. RICHTER