Abstract: A system, probe and method accurately measure the strain or extension of a fastener that occurs as a nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections, which result in a higher magnitude and more easily and precisely measurable reflected signal peak than a signal peak associated with a signal directly reflected against the opposite end of the fastener.

Abstract: A system, probe and method accurately measure the strain or extension of a fastener that occurs as a nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections, which result in a higher magnitude and more easily and precisely measurable reflected signal peak than a signal peak associated with a signal directly reflected against the opposite end of the fastener.

Abstract: In the present disclosure, embodiments including a system, probe and method are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections.

Abstract: In the present disclosure, embodiments including a system, probe and method are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal and shear wave reflections.

Abstract: In the present disclosure, embodiments including a system, device and methods are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal wave reflections and a mode conversion to a shear wave.

Abstract: A visual inspection system (100, 200) for optical fibers (150) includes at least a pattern source (120, 220A, 220B, 220C, 520); at least a first illumination source (130, 230A, 230B, 230C, 510, 522) to direct light towards an optical fiber (150); and at least a first camera (140, 240A, 240B, 240C, 540) positioned at an opposite side of the fiber (150) from the pattern source (120, 220A, 220B, 220C, 520). At least one image (170, 180, 190) of the optical fiber (150) is taken and a pattern visible through the optical fiber (150) in the image (170, 180, 190) may be analyzed to detect distortions in the pattern.

Abstract: In the present disclosure, embodiments including a system, device and methods are disclosed for accurately measuring the strain or extension of a fastener that occurs as the nut on the fastener is tightened and the fastener is put under load. The measurement technique is based on measurement of the time for an ultrasonic wave generated on one end of the fastener to travel a round trip through the fastener. As the fastener is tightened, the applied stress causes an associated increase in length. This length can be determined from a measurement of the increase in transit time. In various embodiments, the disclosed device and method uses laser ultrasonic testing (LUT), in which a pulsed laser generates the ultrasonic wave and a type of laser vibrometer detects the wave when it returns to the position of generation following a combination of longitudinal wave reflections and a mode conversion to a shear wave.

Abstract: A visual inspection system (100, 200) for optical fibers (150) includes at least a pattern source (120, 220A, 220B, 220C, 520); at least a first illumination source (130, 230A, 230B, 230C, 510, 522) to direct light towards an optical fiber (150); and at least a first camera (140, 240A, 240B, 240C, 540) positioned at an opposite side of the fiber (150) from the pattern source (120, 220A, 220B, 220C, 520). At least one image (170, 180, 190) of the optical fiber (150) is taken and a pattern visible through the optical fiber (150) in the image (170, 180, 190) may be analyzed to detect distortions in the pattern.

Abstract: A device detects underfill voids and solder ball defects via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.

Abstract: A laser ultrasonic measurement system includes a first and a second laser source configured to generate a first and a second laser beam, respectively. A movable mechanical link is arranged to transmit the first laser beam. The movable mechanical link is formed by a plurality of rigid sections interconnected by rotating joints. A robot is configured to support and control the movement of at least a section of the mechanical link to transmit the first laser beam to an object. An optical scanner is positioned proximate to the mechanical link. The optical scanner is configured to direct the first and second laser beams onto the object. An interferometer is optically coupled to the optical scanner. The interferometer is configured to receive reflected light from the object and in response generate an electrical signal. The first laser source is kinematically mounted in a housing assembly.

Abstract: Faults, dimensions and other characteristics of a material or structure are sensed by a coherent beam's reflection from the material when probed with ultrasonic waves or when vibrating at high frequencies. The reflected beam acquires a dynamic phase change substantially different from its original phase and from the phase of a reference beam split from the common source beam. The reflected beam and the reference beam are superimposed by diffraction in an adaptive holographic beam-splitter, and the superimposed beams are detected by a photodetector capable of detecting small phase changes from ultrasonic surface displacements or perturbations. An apparatus and method are disclosed defining an improved crystal homodyne interferometer with an energy source coupled to the crystal and operative to maintain the crystal in a condition for emptying unwanted traps in the crystal.

Abstract: The invention relates to a method and inspection system for non-destructive inspection of a colony of stress corrosion cracks in a pipe or a vessel. The method comprises mapping the colony of stress corrosion cracks, identifying at least one individual crack to be sized within the colony, and sizing the at least one individual crack to be sized.

Abstract: A laser ultrasonic measurement system includes a first and a second laser source configured to generate a first and a second laser beam, respectively. A movable mechanical link is arranged to transmit the first laser beam. The movable mechanical link is formed by a plurality of rigid sections interconnected by rotating joints. A robot is configured to support and control the movement of at least a section of the mechanical link to transmit the first laser beam to an object. An optical scanner is positioned proximate to the mechanical link. The optical scanner is configured to direct the first and second laser beams onto the object. An interferometer is optically coupled to the optical scanner. The interferometer is configured to receive reflected light from the object and in response generate an electrical signal. The first laser source is kinematically mounted in a housing assembly.

Abstract: A device detects underfill voids and solder ball defects via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.

Abstract: Underfill voids and solder ball defects are detected via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Alternatively, the generation laser beam may be absorbed in the bulk of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using overlapping probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.

Abstract: Subsurface defects in a processed metal are detected by a laser-ultrasonic method involving generation of a surface acoustic wave at one location on the processed metal surface, and detection of a scattered acoustic wave at another location on the processed metal surface. The method can be used in-line to provide real time monitoring of laser cladding and other metal processing operations.

Abstract: Subsurface defects in a processed metal are detected by a laser-ultrasonic method involving generation of a surface acoustic wave at one location on the processed metal surface, and detection of a scattered acoustic wave at another location on the processed metal surface. The method can be used in-line to provide real time monitoring of laser cladding and other metal processing operations.

Abstract: A composition for the treatment of skin comprises a carboxylated, acidic amino acid obtained by acidifying an acidic amino acid with a carboxylic acid. The resultant material, which is also referred to as a tricarboxylic acid or an amino fruit acid, has significant benefit for the treatment of a number of skin conditions. In addition, the composition of the present invention is very noncaustic to skin, even when employed at a pH as low as 0.5. Also disclosed herein are therapeutic methods and compositions which employ the carboxylated acidic amino acids.

Abstract: Dynamic vibration monitoring of a cutting tool or workpiece is provided by propagating an ultrasonic carrier beam in a stream of fluid flowing from a probe chamber, which includes a transducer, to the cutting tool or workpiece target area. The modulated ultrasonic beam reflected from the target is detected via a transducer in the chamber, and is demodulated to provide measurements of vibrational surface displacement and velocity. The method is insensitive to the target surface roughness and can be used for dynamic characterization prior to machining, and for monitoring during the machining operation. The device is inexpensive and robust to the machining environment, and can be applied to small cutting tools.

Abstract: Underfill voids and solder ball defects are detected via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Alternatively, the generation laser beam may be absorbed in the bulk of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using overlapping probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.