Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.

Abstract: Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.

Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

Abstract: Embodiments of the invention provide methods for packaging integrated circuits and/or other electronic components with electrochemically fabricated structures which include conductive interconnection elements. In some embodiments the electrochemically produced structures are fabricated on substrates that include conductive vias while in other embodiments, the substrates are solid blocks of conductive material, or conductive material containing passages that allow the flow of fluid to maintain desired thermal properties of the packaged electronic components.