Abstract: A process of bonding a coating of a polyurethane resin to a polyolefin substrate is provided. The polyolefin substrate is coated with a graft copolymer of a polyolefin and a functional monomer such as acrylic acid. The graft copolymer is flame treated to fuse it. A liquid polyurethane precursor composition is then applied thereto and cured.

Abstract: Components can be held down on printed circuit boards by applying compositions comprising a water soluble polymeric compound or mixture of compounds which can be dissolved in water to give a greater than 45% solids content with a viscosity range of about 8 to about 12 poises at about 25.degree. C., a water soluble mono- or polyhydric alcohol, water, a wetting agent, and a water soluble organic acid having a keto oxygen group within 4 carbon atoms of the carboxylic acid group, to the printed circuit board prior to insertion of the components to keep them in place during soldering operations. The mixture can be completely removed after soldering by a water rinse.

Abstract: A release coating for printing wiring board racks comprises 100 parts by weight of a polyethylene glycol having a molecular weight range of from about 3000 to 3700, about 20 to about 200 parts by weight of a liquid polyethylene glycol having a molecular weight range of from about 380 to about 420, and from 0 to about 35 parts by weight of water.

Abstract: Components can be held down on printed circuit boards by applying compositions comprising a water soluble polymeric compound or mixture of compounds which can be dissolved in water to give a greater than 45% solids content with a viscosity range of about 8 to about 12 poises at about 25.degree. C., a water soluble mono- or polyhydric alcohol, water, a wetting agent, and a water soluble organic acid having a keto oxygen group within 4 carbon atoms of the carboxylic acid group, to the printed circuit board prior to insertion of the components to keep them in place during soldering operations. The mixture can be completely removed after soldering by a water rinse.

Abstract: A cured epoxy resin composition containing high concentrations of liquid polysulfide polymers has improved resistance to thermal cycling and degradation by moisture.

Abstract: Components can be held down on a printed circuit board without lead clinching by applying an extrudable, non-flowing, heat resistant completely diluent-solvent soluble composition over and around the components to keep them in place during soldering operations. After soldering, the hold down compound is removed by a solvent rinse. The hold down compound comprises a carboxylic acid, a cellulose compound, a solid hydrocarbon resin, a thickening agent, and a non-aqueous diluent-solvent.

Abstract: Components can be held down on a printed circuit board without lead clinching by applying a non-flowing, water soluble mixture containing a polyalkylene glycol, a starch filler and a nonionic surface active agent over the components to keep them in place during soldering operations. The mixture can be completely removed after soldering by a water rinse.