Patents by Inventor Marvin R. Gestole

Marvin R. Gestole has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ROBUST LEADED MOLDED PACKAGES AND METHODS FOR FORMING THE SAME
    Publication number: 20090236714
    Abstract: A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.
    Type: Application
    Filed: June 5, 2009
    Publication date: September 24, 2009
    Inventors: Elsie Agdon Cabahug, Marvin R. Gestole, Margie S. Tumulak-Rios, Lilith U. Montayre, Romel N. Manatad
  • Method of packaging a plurality of devices utilizing a plurality of lead frames coupled together by rails
    Patent number: 6762067
    Abstract: A method and arrangement for packaging a plurality of chip devices. The method includes providing a plurality of bottom leadframes coupled together with rails to form a bottom leadframe assembly and providing a plurality of top leadframes coupled together with rails to form a top leadframe assembly. Dies are placed between the top and bottom leadframes and the top and bottom leadframe assemblies are coupled to one another. The dies are attached to die attach pads of the bottom leadframes and are coupled to the top leadframes with solder bumps. A molded body is placed around the top and bottom leadframes with the dies therebetween and the rails are removed from the top and bottom leadframes, thus providing a plurality of chip devices.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: July 13, 2004
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Maria Clemens Y. Quinones, Gilmore S. Baje, Maria Christina B. Estacio, Marvin R. Gestole, Oliver M. Ledon, Santos E. Mepieza
  • Robust leaded molded packages and methods for forming the same
    Publication number: 20030193080
    Abstract: A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach region includes depressions proximate the inner portions of the leads, and an aperture in the die attach region. A semiconductor die is mounted to the die attach region. A molding material passes through the aperture and covers the first surface of the semiconductor die and the die attach region.
    Type: Application
    Filed: April 14, 2003
    Publication date: October 16, 2003
    Inventors: Elsie Agdon Cabahug, Marvin R. Gestole, Margie S. Tumulak-Rios, Lilith U. Montayre, Romel N. Manatad