Patents by Inventor Marvin T. Johnson

Marvin T. Johnson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170325559
    Abstract: Cup holders are disclosed that can be attached to the telescoping handle of modern luggage in order to provide a convenient place to set down a beverage during waits in airports, train stations, hotel lobbies and other places. In one form, an adjustable lanyard is provided with an adjustable clamp. The lanyard is placed around the telescoping handle and a portion of the lanyard is pulled through the adjustable clamp until the cup holder is secured to the luggage.
    Type: Application
    Filed: July 28, 2014
    Publication date: November 16, 2017
    Inventor: Marvin T. Johnson
  • Patent number: 5581695
    Abstract: A source-level run-time software code debugging instrument (10) includes target access probe ("TAP") (12) and communications adapter ("COMDAP") (14) that process emulation commands provided by source-level debugging software operating on a host computer. The TAP includes a TAP CPU (28) that receives target CPU input signals and delivers target CPU output signals for controlling the execution of software code by the target circuit in accordance with command signals provided by the host computer. The TAP also includes programmable logic cell array (24) and RAM (34). The TAP logic cell array routes command and data signals to and from the TAP CPU, and the RAM stores an in-circuit emulation ("ICE") program used by the TAP to operate the target circuit. The COMDAP is physically separate from the TAP and provides an interface between the host computer and the TAP. The COMDAP includes a programmable logic cell array (44) and an EPROM (46).
    Type: Grant
    Filed: July 7, 1994
    Date of Patent: December 3, 1996
    Assignee: Applied Microsystems Corporation
    Inventors: Robin L. Knoke, Marvin T. Johnson
  • Patent number: 5228039
    Abstract: A source-level run-time software code debugging instrument (10) includes a target access probe ("TAP") (12) and a communications adapter ("COMDAP") (14) that process emulation commands provided by source-level debugging software operating on a host computer. The TAP includes a TAP CPU (28) that receives target CPU input signals and delivers target CPU output signals for controlling the execution of software code by the target circuit in accordance with command signals provided by the host computer. The TAP also includes a programmable logic cell array (24) and a RAM (34). The TAP logic cell array routes command and data signals to and from the TAP CPU, and the RAM stores an in-circuit emulation ("ICE") program used by the TAP to operate the target circuit. The COMDAP is physically separate from the TAP and provides an interface between the host computer and the TAP. The COMDAP includes a programmable logic cell array (44) and an EPROM (46).
    Type: Grant
    Filed: May 9, 1990
    Date of Patent: July 13, 1993
    Assignee: Applied Microsystems Corporation
    Inventors: Robin L. Knoke, Marvin T. Johnson
  • Patent number: 5049090
    Abstract: An electrical connector (10) provides mechanical coupling and electrical contact between the multiple wires (12) of a flat cable assembly (14) and multiple electrically conductive pads (18) of a printed circuit board (16). The electrical connector includes a substantially rigid electrically nonconductive spacing element (30) having first and second opposed side margins (32 and 34) that include respective comb-like portions (35a and 35b) shaped in alternating tabs (36) and slots (40). The slots and tabs are adapted to respectively receive and hold in spaced-apart relation the wires of the flat cable assembly. A resilient material (42) that is electrically conductive in directions only substantially parallel to a conduction axis (44) is secured between the substrate and the spaced-apart wires held by the spacing element. The resilient material provides multiple separate electrically conductive pathways between the wires and the conductive pads.
    Type: Grant
    Filed: February 2, 1990
    Date of Patent: September 17, 1991
    Assignee: Applied Microsystems Corporation
    Inventor: Marvin T. Johnson