Abstract: Methods and apparatus to support an overhanging region of stacked die are disclosed. A disclosed method comprises bonding a first die onto a substrate, placing a support element on the substrate; and bonding a second die onto the first die, wherein the second die overhangs at least one edge of the first die and the support element is positioned to limit bending of the second die.

Abstract: A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.

Abstract: A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.

Abstract: A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.

Abstract: A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.

Abstract: A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.

Abstract: A protective cover (10) for an optical device, such as a spatial light modulator or an infrared detector or receiver. The cover (10) has an optically transmissive window (11), which has a coating (12) on one or both of its surfaces. The coating (12) is made from a halogenated material, which is deposited to form a chemical bond with the surface of the window (11).

Abstract: A plasma conditioning method of improving the adhesion between an integrated circuit chip, having active and passive surfaces, the active surface polymer-coated and having a plurality of electrical coupling members, and an insulating underfill material. The method comprises the steps of positioning a wafer having a plurality of integrated circuits, including the coupling members, in a vacuum chamber of a plasma apparatus so that the polymer-coated surface faces the plasma source. Next, a plasma is initiated; the ion mean free path is controlled so that the ions reach the wafer surface with predetermined energy. The wafer surface is then exposed to the plasma for a length of time sufficient to roughen the polymer surface, clean the polymer surface from organic contamination and improve the surface affinity to adhesion. The adhesion ability of this surface to organic underfill material is thus enhanced.

Abstract: An embodiment of the instant invention is a method of making a semiconductor device situated within a package with conductive leads extending from the package, the method comprising the steps of: testing a plurality of the semiconductor devices so as to determine defective devices; and marking the defective devices with a polymer marker able to withstand temperatures in excess of 200 C., acids with a pH of less than 2, and basic solutions with a pH of greater than 11. Preferably, the polymer marker is comprised of a surfactant, a solvent, a polymer backbone, and a dye, and may additionally include an adhesion promoter. The surfactant is, preferably, comprised of: SVC-15, isopropanol, and any combination thereof. The solvent is, preferably, comprised of a substance consisting of: ENSOLV, bromopropane, chloropropane, and C.sub.n H.sub.2n+1 X (where X is a halogen and n is between 3 and 5), and any combination thereof.

Abstract: This is a Braille display device which comprises: a plurality of cavities; and circuitry to individually excite the plurality of cavities. The plurality of cavities contain a positive and a negative electrode 18, 22, 26 and are filled with a quantity of polar organic gel 24 sensitive to electric fields. The cavities are sealed by an elastomeric film 14. The elastomeric film is held generally flat, by its own tension, in the absence of any voltage applied to the electrodes 18, 22, 26 in the plurality of cavities. The display device can also include circuitry to determine whether the cavity has been touched by person who is reading the display. The display device can also include circuitry to individually vibrate each cavity. Other devices, systems and methods are also disclosed.