Patents by Inventor Marwan Tedjini

Marwan Tedjini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding by direct adhesion
    Patent number: 10957539
    Abstract: A process includes the successive steps of: a) providing first and second substrates, each including a first surface and an opposite, second surface, lateral edges connecting the first and second surfaces, b) bonding the first substrate to the second substrate by direct bonding with the first surfaces of the first and second substrates so as to form a bonding interface (IC), and making the lateral edges of the first and second substrates hydrophobic on either side of the bonding interface (IC).
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: March 23, 2021
    Assignee: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Frank Fournel, Vincent Larrey, Christophe Morales, Marwan Tedjini
  • METHOD FOR BONDING BY DIRECT ADHESION
    Publication number: 20190214259
    Abstract: A process includes the successive steps of: a) providing first and second substrates, each including a first surface and an opposite, second surface, lateral edges connecting the first and second surfaces, b) bonding the first substrate to the second substrate by direct bonding with the first surfaces of the first and second substrates so as to form a bonding interface (IC), and making the lateral edges of the first and second substrates hydrophobic on either side of the bonding interface (IC).
    Type: Application
    Filed: December 3, 2018
    Publication date: July 11, 2019
    Applicant: Commissariat a l'energie atomique et aux energies alternatives
    Inventors: Frank Fournel, Vincent Larrey, Christophe Morales, Marwan Tedjini