Patents by Inventor Mary A. Emmett
Mary A. Emmett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7575146Abstract: An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.Type: GrantFiled: November 11, 2008Date of Patent: August 18, 2009Assignee: International Business Machines CorporationInventors: Brian D. Chapman, Mary A. Emmett, Arden S. Lake, Wai Mon Wa, Nandu N. Ranadive, Michael Variano, John P. Weir
-
Publication number: 20090065557Abstract: An apparatus for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.Type: ApplicationFiled: November 11, 2008Publication date: March 12, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian D. Chapman, Mary A. Emmett, Arden S. Lake, Wai Mon Wa, Nandu N. Ranadive, Michael Variano, John P. Weir
-
Patent number: 7472818Abstract: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.Type: GrantFiled: April 28, 2006Date of Patent: January 6, 2009Assignee: International Business Machines CorporationInventors: Brian D. Chapman, Mary A. Emmett, Arden S. Lake, Wai Mon Wa, Nandu N. Ranadive, Michael Variano, John P. Weir
-
Publication number: 20070251981Abstract: An apparatus and method for selective rework for surface mount components. A shield assembly encloses a circuit board on which Surface Mount Technology (SMT) modules are soldered. The shield assembly includes a top shield member having an opening over an SMT module to be removed from the circuit board, and a bottom shield member having an opening exposing the solder mount of the SMT module to be removed. An intermediate shield member is located in the opening in the top shield member and extends through the opening to the circuit board and surrounds the SMT module to be removed. A spring loaded mechanism is positioned over the intermediate shield member and grips the SMT module to be removed. The spring loaded mechanism applies removal force for removing the SMT module from the circuit board when heat is applied causing the solder holding the SMT module to the circuit board to reflow.Type: ApplicationFiled: April 28, 2006Publication date: November 1, 2007Applicant: International Business Machines CorporationInventors: Brian Chapman, Mary Emmett, Arden Lake, Wai Wa, Nandu Ranadive, Michael Variano, John Weir
-
Patent number: 5493076Abstract: The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed.Type: GrantFiled: January 26, 1995Date of Patent: February 20, 1996Assignee: International Business Machines CorporationInventors: James M. Levite, Michael Berger, Richard L. Chartrand, Mary A. Emmett, Raymond A. Jackson, James J. Petrone, Richard F. Shortt, Roger A. Stinemire
-
Patent number: 5446961Abstract: The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed.Type: GrantFiled: October 15, 1993Date of Patent: September 5, 1995Assignee: International Business Machines CorporationInventors: James M. Levite, Michael Berger, Richard L. Chartrand, Mary A. Emmett, Raymond A. Jackson, James J. Petrone, Richard F. Shortt, Roger A. Stinemire