Patents by Inventor Mary E. Helmick

Mary E. Helmick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip packaging method
    Patent number: 5837558
    Abstract: An improved method for packaging an integrated circuit chip is disclosed. In accordance with the invention, an integrated circuit chip (12) is mounted on a leadframe (18) having a plurality of leads (20). The integrated circuit chip is electrically connected to the leadframe with wire bonds (22). An encapsulant (26) is then molded around the integrated circuit chip and the leadframe. In a dry bake step, moisture is removed from the encapsulant (26) for dry shipment of the integrated circuit chip subsequent to the molding step. The encapsulant (26) is cured simultaneously with the dry bake step, thus reducing the time and power required to produce the integrated circuit chip package.
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: November 17, 1998
    Assignee: Texas Instruments Incorporated
    Inventors: Edgar R. Zuniga, Mary E. Helmick