Abstract: Photocurable compositions useful in the fabrication of 3D printed articles are formulated to contain a) at least one of a photoinitiator or a photo-releasable base and b) at least one t-amyl peroxide, in addition to at least one photocurable compound.

Abstract: Electrical connector including a connector body having a mating side configured to interface with an electrical component. The electrical connector also includes signal pathways extending through the connector body. The signal pathways are arranged to form pairs of signal pathways. The electrical connector also includes an impedance-control assembly having a plurality of dielectric bodies supported by the connector body. The dielectric bodies surround respective pairs of signal pathways. The dielectric bodies include a dielectric medium and gas bubbles distributed in the dielectric medium. The dielectric medium has a predetermined dielectric constant. The at least one of the gas bubbles or gas-filled particles are sized and distributed in the dielectric medium to achieve a target dielectric constant of the dielectric bodies.

Abstract: Connectors and/or substrates which are made utilizing a low dielectric constant injection moldable polymer or other melt processable polymer, such as, but not limited to, thermoplastic material, thermoplastic composite material, thermoset material, thermoset composite material or a combination thereof. The low dielectric constant injection moldable polymer or other melt processable polymer support noise and/or crosstalk reductions for high speed signal transmission. The low dielectric constant material provides dielectric shielding between adjacent high speed signal lines. The reduced dielectric constant and reduced loss-tangent is created by forming voids or pores within the bulk plastic material, thus increasing the air, gas or void content, and thus decreasing the density and overall dielectric constant of such material. The porosity thus introduced into the shielding between adjacent transmission lines reduces crosstalk and other losses, and thus maintains signal integrity in connector/substrate designs.

Abstract: A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a surface layer on the substrate layer that has pores at least partially exposing the substrate layer, and forming graphene deposits in the pores. Optionally, the graphene deposits may be formed only in the pores. The graphene deposits may be formed along the exposed portions of the substrate layer. The graphene layers may be selectively deposited or may be deposited to cover an entire layer. Optionally, the forming of the graphene deposits may include processing the electrical conductor using a chemical vapor deposition process using an organic compound precursor and heat of sufficient temperature to facilitate graphene growth on the metal compound comprising the substrate layer.

Abstract: Electrical connector including a connector body having a mating side configured to interface with an electrical component. The electrical connector also includes signal pathways extending through the connector body. The signal pathways are arranged to form pairs of signal pathways. The electrical connector also includes an impedance-control assembly having a plurality of dielectric bodies supported by the connector body. The dielectric bodies surround respective pairs of signal pathways. The dielectric bodies include a dielectric medium and gas bubbles distributed in the dielectric medium. The dielectric medium has a predetermined dielectric constant. The at least one of the gas bubbles or gas-filled particles are sized and distributed in the dielectric medium to achieve a target dielectric constant of the dielectric bodies.

Abstract: An electrical contact includes a body having a mating segment. At least a portion of the mating segment defines a first conductive element having a three-dimensional (3D) surface. A dielectric layer is formed directly on the 3D surface of the first conductive element in engagement with the 3D surface. A second conductive element is formed on the dielectric layer such that the dielectric layer extends between the first and second conductive elements. The first and second conductive elements and the dielectric layer form a capacitor.

Abstract: A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a surface layer on the substrate layer that has pores at least partially exposing the substrate layer, and forming graphene deposits in the pores. Optionally, the graphene deposits may be formed only in the pores. The graphene deposits may be formed along the exposed portions of the substrate layer. The graphene layers may be selectively deposited or may be deposited to cover an entire layer. Optionally, the forming of the graphene deposits may include processing the electrical conductor using a chemical vapor deposition process using an organic compound precursor and heat of sufficient temperature to facilitate graphene growth on the metal compound comprising the substrate layer.

Abstract: An electrical contact includes a body having a mating segment. At least a portion of the mating segment defines a first conductive element having a three-dimensional (3D) surface. A dielectric layer is formed directly on the 3D surface of the first conductive element in engagement with the 3D surface. A second conductive element is formed on the dielectric layer such that the dielectric layer extends between the first and second conductive elements. The first and second conductive elements and the dielectric layer form a capacitor.

Abstract: A contact assembly includes a conductive substrate, a composite layer, and a conductive layer. The conductive substrate is configured to form a conductive path of the electrical connector. The composite layer is engaged to the conductive substrate and includes a dielectric material with a conductive filler material dispersed within the dielectric material at a concentration that is lower than a percolation threshold concentration of the composite layer. The conductive layer is engaged to the composite layer. The conductive substrate, the composite layer, and the conductive layer form a capacitive element through which a signal propagation path between the conductive substrate and a mating contact that mates with the conductive layer passes.