Abstract: Organic films are applied from solvent solution to a substrate, then are ion implanted to have resistivity in the kilohm/square to gigaohm/square range. The films are then patterned by standard lithographic procedures, with surprisingly little loss of conductivity, in spite of contact with organic solvents or acidic or basic etchant solutions during the patterning process. Both structures which contact the substrate, and freestanding conductive polymer bridges, can be formed. The invention provides a method of producing electrical devices which does not require the use of single crystal semiconductor substrates or deposition of inorganic semiconductors. The resulting devices are highly resistant to damage from abrasion, solvents, acids, bases, and moisture.

Abstract: The invention is a method and apparatus for a pirani pressure sensor. The apparatus consists of a current supply and current receiving means affixed to a substrate. Bridging the current supply means and current receiving means is an electrically conductive polymer. The pirani pressure sensor may be made using conventional photolithographic techniques.

Abstract: The invention is an apparatus and method for making a polymer bolometer. The apparatus consists of a current supply and current receiving paths affixed to a substrate. Bridging the current supply paths and current receiving paths is an electrically conductive polymer. The polymer bolometer may be fabricated using conventional photolithographic techniques.

Abstract: An electrical type strain gauge for measuring both micro and macro deformations. The gauge may be constructed from thin films of homogeneously conductive polymers, including soluble polyaniline-based conducting polymers and ion-implanted organic polymers. The gauges are characterized by unexpected piezoresistivity from materials having high bulk resistivity, thermal stability, good flexibility, photoimageability and without adding carbon or metal particulate material to the polymer.

Abstract: Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.

Abstract: Soluble conducting polymers from substituted polyanilines and large organic counterions are disclosed and used directly from solution in the manufacture of electronic devices.

Abstract: Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.

Abstract: Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.

Abstract: An improved method of promoting the adhesion of microelectronic coatings to substrates uses new adhesion promoters, catalysts for adhesion promoters and adjuvant polymers.

Abstract: An improved method for improving the adhesion of microelectronic coatings to substrates uses a new silane adhesion promoter and hydroxylic solvent combination. An improved silane adhesion promoter contains an aqueous solvent composition containing a hydroxylic solvent.