Abstract: Described herein is an apparatus and a method for a cluster connector. The cluster connector comprises at least three coaxial-cable core conductors formed in an additive manufacturing process; a dielectric around each of the three coaxial-cable core conductors, formed in the additive manufacturing process; a metallic shield around each dielectric, formed in the additive manufacturing process; at least one stub on each metallic shield, formed in the additive manufacturing process; and a common ground connection connected to each metallic shield, formed in the additive manufacturing process.

Abstract: A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800° Celsius (° C.).

Abstract: A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt.% zirconium, and about 18 to about 19 weight% (wt.%) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800° C. (°C).

Abstract: A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800° Celsius (° C.).

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.

Abstract: A flexure including a bipod strut pair extending from a base and a titanium-zirconium-niobium alloy, which includes titanium, about 13.5 to about 14.5 wt. % zirconium, and about 18 to about 19 weight % (wt. %) niobium. The titanium-zirconium-niobium alloy has a congruent melting temperature of about 1750 to about 1800° Celsius (° C.).

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Abstract: A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.

Abstract: A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

Abstract: A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (PCBs). The first PCB includes a first trace, ground planes at opposite sides of the first trace, dielectric material interposed between the first trace and the ground planes and a first end. The first end is formed as a first rabbet at which the first trace is exposed. The second PCB includes a second trace, ground planes at opposite sides of the second trace, dielectric material interposed between the second trace and the ground planes and a second end. The second end is formed as a second rabbet, which is substantially identical to the first rabbet, at which the second trace is exposed. The first and second ends are mated in a shiplap joint to electrically couple the first and second traces.

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

Abstract: A circuit structure includes a signal substrate having a signal trace formed thereon and a microstrip substrate disposed above the signal substrate that includes a microstrip trace formed thereon and a hole passing through it. The circuit structure also includes a conductor passing through and substantially filling the hole passing through the microstrip substrate and electrically contacting the signal trace on the signal substrate and a flat wire connector electrically connecting the microstrip trace to a first end of the conductor, the flat wire connector being arranged such that a gap is formed between the flat wire connector and a top surface of the microstrip substrate.

Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. Blending the dielectric material with the carbon-based ink causes the modified carbon-based ink to have a resistivity that is at least double a resistivity of the carbon-based ink.

Abstract: A method includes blending a dielectric material including a titanate with a carbon-based ink to form a modified carbon-based ink. The method also includes printing the modified carbon-based ink onto a structure. The method further includes curing the printed modified carbon-based ink on the structure at a temperature that does not exceed about 250° C. In addition, the method includes processing the cured printed modified carbon-based ink to form a thick film resistor. An amount of the dielectric material blended with the carbon-based ink does not exceed about 15% by weight of the modified carbon-based ink. The modified carbon-based ink has a resistivity that is at least double a resistivity of the carbon-based ink. The thick film resistor may be configured to handle up to about 200 mA of current without fusing and/or handle up to about 1.0 W of power without fusing.

Abstract: Flexible substrates including a polymer selected from a thermoplastic polymer, a thermoset polymer, and/or a polymer blend, and ferroelectric perovskite-type oxide particles dispersed in the polymer, where the ferroelectric perovskite-type oxide has a dielectric constant that varies with applied voltage. The flexible substrates can be used in tunable electronics.

Abstract: An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.