Patents by Inventor Mary Lanzerotti

Mary Lanzerotti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Design structure and system for identification of defects on circuits or other arrayed products
    Patent number: 7752581
    Abstract: A system and method is disclosed for assessing a probability of failure of operation of a semiconductor wafer. The method includes inputting risk factor data into a memory and inputting a plurality of wafers into a semiconductor fabrication manufacturing process. A subset of wafers is select to obtain a sample population and at least one region of each wafer of the sample population is inspected. Circuit design data associated with each wafer of the sample population is obtained and one or more defects that present an increased risk to the operation of a particular wafer are identified. The identification is a function of the risk factor data, the inspecting step and the circuit design data. A probability of semiconductor wafer failure is calculated.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: July 6, 2010
    Assignee: International Business Machines Corporation
    Inventors: Mary Lanzerotti, Emmanuel Yashchin, Christina Landers, Asya Takken, Brian Trapp
  • Design Structure and System for Identification of Defects on Circuits or Other Arrayed Products
    Publication number: 20080148201
    Abstract: A system and method is disclosed for assessing a probability of failure of operation of a semiconductor wafer. The method includes inputting risk factor data into a memory and inputting a plurality of wafers into a semiconductor fabrication manufacturing process. A subset of wafers is selected to obtain a sample population and at least one region of each wafer of the sample population is inspected. Circuit design data associated with each wafer of the sample population is obtained and one or more defects that present an increased risk to the operation of a particular wafer are identified. The identification is a function of the risk factor data, the inspecting step and the circuit design data. A probability of semiconductor wafer failure is calculated.
    Type: Application
    Filed: January 4, 2008
    Publication date: June 19, 2008
    Inventors: Mary Lanzerotti, Emmanuel Yashchin, Christina Landers, Asya Takken, Brian Trapp
  • Design Structure and System for Identification of Defects on Circuits or Other Arrayed Products
    Publication number: 20080092095
    Abstract: A system and method is disclosed for assessing a probability of failure of operation of a semiconductor wafer. The method includes inputting risk factor data into a memory and inputting a plurality of wafers into a semiconductor fabrication manufacturing process. A subset of wafers is select to obtain a sample population and at least one region of each wafer of the sample population is inspected. Circuit design data associated with each wafer of the sample population is obtained and one or more defects that present an increased risk to the operation of a particular wafer are identified. The identification is a function of the risk factor data, the inspecting step and the circuit design data. A probability of semiconductor wafer failure is calculated.
    Type: Application
    Filed: October 29, 2007
    Publication date: April 17, 2008
    Inventors: Mary Lanzerotti, Emmanuel Yashchin, Christina Landers, Asya Takken, Brian Trapp
  • System for identification of defects on circuits or other arrayed products
    Publication number: 20060265185
    Abstract: A system and method is disclosed for assessing a probability of failure of operation of a semiconductor wafer. The method includes inputting risk factor data into a memory and inputting a plurality of wafers into a semiconductor fabrication manufacturing process. A subset of wafers is selected to obtain a sample population and at least one region of each wafer of the sample population is inspected. Circuit design data associated with each wafer of the sample population is obtained and one or more defects that present an increased risk to the operation of a particular wafer are identified. The identification is a function of the risk factor data, the inspecting step and the circuit design data. A probability of semiconductor wafer failure is calculated.
    Type: Application
    Filed: July 25, 2006
    Publication date: November 23, 2006
    Inventors: Mary Lanzerotti, Emmanuel Yashchin, Christina Landers, Asya Takken, Brian Trapp