Abstract: A pediatric head covering to facilitate obtaining three-dimensional images of a head of an infant to be utilized in manufacture of a cranial remodeling orthosis for correction of an abnormal head shape comprises sheer elastic material to be drawn down over an infant's head to compress the hair of an infant and to provide a smooth surface over the infant's cranium. The elastic material has variable elasticity with less elasticity over the crown of the cranium to provide enough strength to compress the infant's hair and conform to the shape of the cranium and more elasticity at the infant's neck to control soft tissue of the infant's neck without leading to distortion of the soft tissue and causing misrepresentations of the actual neck shape in captured three-dimensional images. The head covering facilitates accurate capture and reproduction of three-dimensional images of the infant's head by a three-dimensional image capturing system.

Abstract: A pediatric head covering to facilitate obtaining three-dimensional images of a head of an infant to be utilized in manufacture of a cranial remodeling orthosis for correction of an abnormal head shape comprises sheer elastic material to be drawn down over an infant's head to compress the hair of an infant and to provide a smooth surface over the infant's cranium. The elastic material has variable elasticity with less elasticity over the crown of the cranium to provide enough strength to compress the infant's hair and conform to the shape of the cranium and more elasticity at the infant's neck to control soft tissue of the infant's neck without leading to distortion of the soft tissue and causing misrepresentations of the actual neck shape in captured three-dimensional images. The head covering facilitates accurate capture and reproduction of three-dimensional images of the infant's head by a three-dimensional image capturing system.

Abstract: This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

Abstract: The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.

Abstract: The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention encompasses an apparatus that uses a porous backing material which is adhered to a green sheet during the screening process. Basically, a backing layer having a very high porosity is adhered to a green sheet, while the green sheet is screened. During the drying process of the green sheet some of the screening fluids are absorbed by the porous backing layer, which allows the screened vias of the green sheet to have a smooth surface.