Abstract: Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.

Abstract: Fluid ejection head assemblies, fluid ejection devices, and methods for improving fluid sealing of fluid ejection head assemblies. One such fluid ejection head assembly includes a substrate cavity and a substantially planar surface surrounding the substrate cavity. The substantially planar surface contains at least one external vent, at least one internal vent channel, and a plurality of vents in fluid flow communication with the substrate cavity and providing fluid flow communication between the internal vent channel and the external vent. The plurality of vents, the at least one external vent and the at least one internal vent channel are disposed in fluid flow communication with an environment external to the substrate cavity for flow of a gas associated with an adhesive at least partially disposed in the substrate cavity, to the environment during the curing of the adhesive.

Abstract: A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm?1 on the micro-fluid ejection device structures or on the cartridge body.

Abstract: A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.

Abstract: A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm?1 on the micro-fluid ejection device structures or on the cartridge body.

Abstract: A method for manufacturing an inkjet print cartridge and an inkjet cartridge produced thereby are disclosed. An inkjet print cartridge in accordance with one aspect includes a component of the inkjet print cartridge and an applied adhesive on at least a portion of the component, wherein the applied adhesive is formed from an adhesive having a rheology viscosity ratio ?i/?min of from 1.0 to less than 2.1. The method in accordance with one aspect includes applying an adhesive onto at least a portion of a component of an inkjet print cartridge at an application temperature, T?, and heating the adhesive from an initial temperature, Ti, to a cure temperature for the adhesive, Tc. The adhesive has a rheology cure profile characterized by at least one of the following parameters: a) a rheology viscosity ratio ?i/?min of from 1.0 to less than 2.

Abstract: A stencil printed encapsulant material is provided for use in protecting electrical components in thermal ink jet printhead cartridges. A method of applying an encapsulant material to an ink jet print cartridge by stencil printing is also provided. The method includes providing a stencil having at least one aperture, providing an ink jet cartridge and stencil printing an encapsulant material onto a portion of the ink jet print cartridge thereby forming a layer of encapsulant material to protect electrical components or other printhead components.