Patents by Inventor Mary Teo

Mary Teo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package and a method for forming an integrated circuit package
    Patent number: 8357565
    Abstract: A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.
    Type: Grant
    Filed: October 1, 2010
    Date of Patent: January 22, 2013
    Assignee: Infinenon Technologies AG
    Inventors: Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim, Khoon Lam Chua
  • Magnetically alignable integrated circuit device
    Patent number: 7994608
    Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: August 9, 2011
    Assignee: Infineon Technologies AG
    Inventors: Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim
  • Integrated Circuit Package and a Method for Forming an Integrated Circuit Package
    Publication number: 20110020985
    Abstract: A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.
    Type: Application
    Filed: October 1, 2010
    Publication date: January 27, 2011
    Inventors: Gerald OFNER, Swain Hong YEO, Mary TEO, Pei Siang LIM, Khoon Lam CHUA
  • Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
    Patent number: 7768137
    Abstract: A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: August 3, 2010
    Assignee: Infineon Technologies AG
    Inventors: Gerald Ofner, Ai Min Tan, Mary Teo
  • Magnetically Alignable Integrated Circuit Device
    Publication number: 20080265367
    Abstract: An integrated circuit device includes a semiconductor chip having an active surface with a plurality of chip contact pads, a rewiring substrate and an electrically conductive inductor coil for magnetically aligning the semiconductor chip with the rewiring substrate.
    Type: Application
    Filed: August 24, 2005
    Publication date: October 30, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ai Min Tan, Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim
  • Integrated Circuit Package and a Method for Forming an Integrated Circuit Package
    Publication number: 20080122053
    Abstract: A method of forming an integrated circuit package, such as a Flip Chip package, in which a void is provided in the underfill material in the central region of the package between the chip or die and the substrate on which the chip or die is mounted. This reduces delamination of the package as a result of moisture.
    Type: Application
    Filed: February 4, 2008
    Publication date: May 29, 2008
    Inventors: Gerald Ofner, Swain Hong Yeo, Mary Teo, Pei Siang Lim, Khoon Lam Chua
  • Semiconductor chip with flip chip contacts, and method for producing semiconductor chip with flip chip contacts
    Publication number: 20060270163
    Abstract: A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.
    Type: Application
    Filed: May 8, 2006
    Publication date: November 30, 2006
    Inventors: Gerald Ofner, Ai Tan, Mary Teo