Abstract: In one embodiment, the semiconductor device includes a first source of a first doping type disposed in a substrate. A first drain of the first doping type is disposed in the substrate. A first gate region is disposed between the first source and the first drain. A first channel region of a second doping type is disposed under the first gate region. The second doping type is opposite to the first doping type. A first extension region of the first doping type is disposed between the first gate and the first drain. The first extension region is part of a first fin disposed in or over the substrate. A first isolation region is disposed between the first extension region and the first drain. A first well region of the first doping type is disposed under the first isolation region. The first well region electrically couples the first extension region with the first drain.

Abstract: Embodiments relate to a field-effect device that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region, and a pocket implant region adjacent to the first source/drain region, the pocket implant region being of a second conductivity type, wherein the second conductivity type is different from the first conductivity type. The body region physically contacts the pocket implant region.

Abstract: In various embodiments, a method for manufacturing a semiconductor device is provided. The method for manufacturing a semiconductor device may include forming a first source/drain region, forming a second source/drain region, forming an active region electrically coupled between the first source/drain region and the second source/drain region, forming a trench disposed between the second source/drain region and at least a portion of the active region, forming a first isolation layer disposed over the bottom and the sidewalls of the trench, forming electrically conductive material disposed over the isolation layer in the trench, forming a second isolation layer disposed over the active region, and forming a gate region disposed over the second isolation layer. The electrically conductive material may be coupled to an electrical contact.

Abstract: Embodiments relate to a field-effect device that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region, and a pocket implant region adjacent to the first source/drain region, the pocket implant region being of a second conductivity type, wherein the second conductivity type is different from the first conductivity type. The body region physically contacts the pocket implant region.

Abstract: Embodiments relate to a field-effect device that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region, and a pocket implant region adjacent to the first source/drain region, the pocket implant region being of a second conductivity type, wherein the second conductivity type is different from the first conductivity type. The body region physically contacts the pocket implant region.

Abstract: In one embodiment, the semiconductor device includes a first source of a first doping type disposed in a substrate. A first drain of the first doping type is disposed in the substrate. A first gate region is disposed between the first source and the first drain. A first channel region of a second doping type is disposed under the first gate region. The second doping type is opposite to the first doping type. A first extension region of the first doping type is disposed between the first gate and the first drain. The first extension region is part of a first fin disposed in or over the substrate. A first isolation region is disposed between the first extension region and the first drain. A first well region of the first doping type is disposed under the first isolation region. The first well region electrically couples the first extension region with the first drain.

Abstract: In various embodiments, a method for manufacturing a semiconductor device is provided. The method for manufacturing a semiconductor device may include forming a first source/drain region, forming a second source/drain region, forming an active region electrically coupled between the first source/drain region and the second source/drain region, forming a trench disposed between the second source/drain region and at least a portion of the active region, forming a first isolation layer disposed over the bottom and the sidewalls of the trench, forming electrically conductive material disposed over the isolation layer in the trench, forming a second isolation layer disposed over the active region, and forming a gate region disposed over the second isolation layer. The electrically conductive material may be coupled to an electrical contact.

Abstract: In one embodiment, the semiconductor device includes a first source of a first doping type disposed in a substrate. A first drain of the first doping type is disposed in the substrate. A first gate region is disposed between the first source and the first drain. A first channel region of a second doping type is disposed under the first gate region. The second doping type is opposite to the first doping type. A first extension region of the first doping type is disposed between the first gate and the first drain. The first extension region is part of a first fin disposed in or over the substrate. A first isolation region is disposed between the first extension region and the first drain. A first well region of the first doping type is disposed under the first isolation region. The first well region electrically couples the first extension region with the first drain.

Abstract: In various embodiments, a semiconductor device is provided. The semiconductor device may include a first source/drain region, a second source/drain region, an active region electrically coupled between the first source/drain region and the second source/drain region, a trench disposed between the second source/drain region and at least a portion of the active region, a first isolation layer disposed over the bottom and the sidewalls of the trench, electrically conductive material disposed over the isolation layer in the trench, a second isolation layer disposed over the active region, and a gate region disposed over the second isolation layer. The electrically conductive material may be coupled to an electrical contact.

Abstract: Embodiments of the disclosure may generally relate to an analog to digital converter. An example analog to digital converter may include a unit capacitor array, a comparator and a control block. The unit capacitor array may include multiple capacitors coupled to one another via multiple switches under control of the control block. The comparator, having a first input and a second input, may be configured to receive a controlled voltage generated from the unit capacitor array and compare an analog voltage to the controlled voltage. The control block may be configured to selectively open or close the switches, receive a comparison result from the comparator, and generate a digital output based on the comparison result. The control block may be configured to control the switch timing of the unit capacitor array for reset, pre-charge, charge redistribution, and comparison phases, where a passive charge redistribution method may be utilized.

Abstract: This disclosure relates to devices and methods relating to coupled first and second device portions.

Abstract: A nonvolatile floating gate analog memory cell (1) comprising a transistor having a source (2) and drain (3) formed inside a substrate or on an insulator body (not shown) and separated by a channel (4). The memory cell comprises at least one floating gate (5) formed on one side of the source and drain. (6) is a control gate formed on one side of the floating gate and connected to a first voltage (7). (8) is a back gate formed on the other side of the source and drain and connected to a second voltage (9). The channel is separated from the floating gate and the back gate by an insulation layer (10). The control gate is separated from the floating gate by an insulation layer (11) and the source and drain are isolated from the back gate, control gate and floating gate(s) by a spacer (12). The second voltage changes the intrinsic threshold voltage linearly during programming so that the programmed threshold voltage corresponds to the second voltage.

Abstract: Embodiments relate to a field-effect transistor that includes a body region, a first source/drain region of a first conductivity type, a second source/drain region of the first conductivity type, and a pocket implant region adjacent to the first source/drain region, the pocket implant region being of a second conductivity type, wherein the second conductivity type is different from the first conductivity type. The body region physically contacts the pocket implant region.

Abstract: Techniques are generally described herein for analog to digital conversion. Some example ADC converters include a unit capacitor array coupled to a reference voltage, where the capacitor array includes multiple capacitors coupled to one another via multiple switches under control of a control block. A comparator, having a first input and a second input, is configured to receive a controlled voltage generated from the unit capacitor array and compare an analog voltage to the controlled voltage. The control block is configured to selectively open or close the switches, receive a comparison result from the comparator, and generate a digital output based On the comparison result. The control block is configured to control the switch timing of the unit capacitor array for reset, pre-charge, charge redistribution, and comparison phases, where a passive charge redistribution method may be utilized.

Abstract: In one embodiment, the semiconductor device includes a first source of a first doping type disposed in a substrate. A first drain of the first doping type is disposed in the substrate. A first gate region is disposed between the first source and the first drain. A first channel region of a second doping type is disposed under the first gate region. The second doping type is opposite to the first doping type. A first extension region of the first doping type is disposed between the first gate and the first drain. The first extension region is part of a first fin disposed in or over the substrate. A first isolation region is disposed between the first extension region and the first drain. A first well region of the first doping type is disposed under the first isolation region. The first well region electrically couples the first extension region with the first drain.

Abstract: In an embodiment, a semiconductor device is provided. The semiconductor device may include a first diffusion region, a second diffusion region an active region disposed between the first diffusion region and the second diffusion region, a control region disposed above the active region, a first trench isolation disposed laterally adjacent to the first diffusion region opposite to the active region, and a second trench isolation disposed between the second diffusion region and the active region. The second trench isolation may have a smaller depth than the first trench isolation.

Abstract: A slew rate improved operational amplifier circuit is provided to improve the slew rates of an operational amplifier with minimal sacrifices in power dissipation and other operational amplifier parameters. To improve the slew rates of operational amplifiers, additional current sources are activated when a slewing operation is detected. The detection of slewing operations and the activation of current sources upon detection can be implemented using two comparator circuits—one for a positive slewing operation, and one for a negative slewing operation. A sub-45 nm FinFET implementation of this slew rate improvement concept was implemented and compared against slew rate optimized individual two-stage operational amplifiers. Simulations show that slew rates were significantly improved by the implementation of the comparator circuits (5590 V/?s vs. 273 V/?s), with minimal increases in power dissipation (78 ?W vs. 46 ?W).

Abstract: A slew rate improved operational amplifier circuit is provided to improve the slew rates of an operational amplifier with minimal sacrifices in power dissipation and other operational amplifier parameters. To improve the slew rates of operational amplifiers, additional current sources are activated when a slewing operation is detected. The detection of slewing operations and the activation of current sources upon detection can be implemented using two comparator circuits—one for a positive slewing operation, and one for a negative slewing operation. A sub-45 nm FinFET implementation of this slew rate improvement concept was implemented and compared against slew rate optimized individual two-stage operational amplifiers. Simulations show that slew rates were significantly improved by the implementation of the comparator circuits (5590 V/?s vs. 273 V/?s), with minimal increases in power dissipation (78 ?W vs. 46 ?W).

Abstract: In various embodiments, a semiconductor device is provided. The semiconductor device may include a first source/drain region, a second source/drain region, an active region electrically coupled between the first source/drain region and the second source/drain region, a trench disposed between the second source/drain region and at least a portion of the active region, a first isolation layer disposed over the bottom and the sidewalls of the trench, electrically conductive material disposed over the isolation layer in the trench, a second isolation layer disposed over the active region, and a gate region disposed over the second isolation layer. The electrically conductive material may be coupled to an electrical contact.

Abstract: This disclosure relates to devices and methods relating to coupled first and second device portions.