Patents by Inventor Marzio Terzoli

Marzio Terzoli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protective envelope for a semiconductor integrated circuit
    Patent number: 6593665
    Abstract: A protective envelope, made of a plastics material for enclosing a semiconductor integrated circuit, includes a flattened parallelepiped body having a sidewall formed of first and second portions set to converge toward each other. The envelope also includes a lead frame embedded in the body and bearing the integrated circuit, the lead frame having a section bent to form a baffle plate orientated toward the first sidewall portion. Advantageously, the bent section of the lead frame has a plane end edge extending parallel to the first sidewall portion at a spacing therefrom.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: July 15, 2003
    Assignee: STMicroelectronics S.r.l.
    Inventors: Roberto Tiziani, Marzio Terzoli
  • Protective envelope for a semiconductor integrated circuit
    Publication number: 20020050630
    Abstract: A protective envelope, made of a plastics material for enclosing a semiconductor integrated circuit, includes a flattened parallelepiped body having a sidewall formed of first and second portions set to converge toward each other. The envelope also includes a lead frame embedded in the body and bearing the integrated circuit, the lead frame having a section bent to form a baffle plate orientated toward the first sidewall portion. Advantageously, the bent section of the lead frame has a plane end edge extending parallel to the first sidewall portion at a spacing therefrom.
    Type: Application
    Filed: April 27, 2001
    Publication date: May 2, 2002
    Inventors: Roberto Tiziani, Marzio Terzoli