Abstract: Monocyclic chlorine based inductively coupled plasma deep etching processes for the rapid micromachining of titanium substrates and titanium devices so produced are disclosed. The method parameters are adjustable to simultaneously vary etch rate, mask selectivity, and surface roughness and can be applied to titanium substrates having a wide variety of thicknesses to produce high aspect ratio features, smooth sidewalls, and smooth surfaces. The titanium microdevices so produced exhibit beneficially high fracture toughness, biocompatibility and are robust and able to withstand harsh environments making them useful in a wide variety of applications including microelectronics, micromechanical devices, MEMS, and biological devices that may be used in vivo.

Abstract: Monocyclic chlorine based inductively coupled plasma deep etching processes for the rapid micromachining of titanium substrates and titanium devices so produced are disclosed. The method parameters are adjustable to simultaneously vary etch rate, mask selectivity, and surface roughness and can be applied to titanium substrates having a wide variety of thicknesses to produce high aspect ratio features, smooth sidewalls, and smooth surfaces. The titanium microdevices so produced exhibit beneficially high fracture toughness, biocompatibility and are robust and able to withstand harsh environments making them useful in a wide variety of applications including microelectronics, micromechanical devices, MEMS, and biological devices that may be used in vivo.

Abstract: Reliable, flaw-tolerant brittle materials are produced by incorporating layers under residual compression on the surface and throughout the bulk of the material that act to trap and contain the propagation of otherwise catastrophic cracking. The residual compression within these layers acts to reduce the stress intensity of the cracks, thereby causing them to arrest until further loading is provided. This highly desirable stable, subcritical crack growth mode persists with increased loading until the applied stress is large enough to drive the crack completely through compressive region, after which failure occurs. The exact level of stress needed to accomplish this is dictated by the architectural design of the compressive layers such that the material can be designed to have any minimum strength desired, within the limits of the materials system used. This results in a truncation of the strength distribution, such that there is virtually zero probability of failure below this minimum value, i.e.