Patents by Inventor Masaaki AKAIWA

Masaaki AKAIWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COPPER ALLOY ASSEMBLY AND PRODUCTION METHOD THEREFOR
    Publication number: 20230356321
    Abstract: There is provided a copper alloy bonded body composed of a plurality of members made of an age-hardenable copper alloy, the members diffusion-bonded to one another. The copper alloy bonded body has undergone solution annealing and an aging treatment, the content of beryllium in the age-hardenable copper alloy is 0.7% by weight or less, and (i) a bonding interface between the members has disappeared and/or (ii) a bonding interface between the members remains, and an oxide film at the bonding interface has a thickness of 0 nm or more and 5.0 nm or less.
    Type: Application
    Filed: June 26, 2023
    Publication date: November 9, 2023
    Applicants: KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, NGK INSULATORS, LTD.
    Inventors: Osamu TAKAKUWA, Hisao MATSUNAGA, Takahiro ISHIKAWA, Hiromitsu UCHIYAMA, Masato SAKAKIBARA, Masaaki AKAIWA
  • MESH STRUCTURE AND METHOD FOR MANUFACTURING SAME, ANTENNA REFLECTION MIRROR, ELECTROMAGNETIC SHIELDING MATERIAL, AND WAVEGUIDE TUBE
    Publication number: 20220064826
    Abstract: A mesh structure is a knitted fabric or woven fabric including element wires of a zirconium copper fiber or element wires of a stainless steel fiber.
    Type: Application
    Filed: January 28, 2020
    Publication date: March 3, 2022
    Inventors: Satoru OZAWA, Kentaro NISHI, Kazuyuki NAKAMURA, Masatoshi MORI, Daisuke MATSUMOTO, Masaaki AKAIWA, Ichizo KAWAMURA
  • Method for manufacturing copper alloy and copper alloy
    Patent number: 10557184
    Abstract: A method for manufacturing a copper alloy according to the present invention comprises (a) weighing a copper powder and one of a Cu—Zr master alloy and a ZrH2 powder such that an alloy composition of Cu-xZr (x is the atomic % of Zr, and 0.5?x?8.6 is satisfied) is obtained and pulverizing and mixing the copper powder and the one of the Cu—Zr master alloy and the ZrH2 powder in an inert atmosphere until an average particle diameter D50 falls within the range of from 1 ?m to 500 ?m to thereby obtain a powder mixture; and (b) subjecting the powder mixture to spark plasma sintering by holding the powder mixture at a prescribed temperature lower than eutectic temperature while the powder mixture is pressurized at a pressure within a prescribed range.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: February 11, 2020
    Assignees: NGK Insulators, Ltd., Tohoku University
    Inventors: Takashi Goto, Hirokazu Katsui, Naokuni Muramatsu, Masaaki Akaiwa
  • METHOD FOR MANUFACTURING COPPER ALLOY AND COPPER ALLOY
    Publication number: 20170130299
    Abstract: A method for manufacturing a copper alloy according to the present invention comprises (a) weighing a copper powder and one of a Cu—Zr master alloy and a ZrH2 powder such that an alloy composition of Cu-xZr (x is the atomic % of Zr, and 0.5?x?8.6 is satisfied) is obtained and pulverizing and mixing the copper powder and the one of the Cu—Zr master alloy and the ZrH2 powder in an inert atmosphere until an average particle diameter D50 falls within the range of from 1 ?m to 500 ?m to thereby obtain a powder mixture; and (b) subjecting the powder mixture to spark plasma sintering by holding the powder mixture at a prescribed temperature lower than eutectic temperature while the powder mixture is pressurized at a pressure within a prescribed range.
    Type: Application
    Filed: November 21, 2016
    Publication date: May 11, 2017
    Applicants: NGK INSULATORS, LTD., TOHOKU UNIVERSITY
    Inventors: Takashi GOTO, Hirokazu KATSUI, Naokuni MURAMATSU, Masaaki AKAIWA