Abstract: The present invention provides an office clip having a high designability while having a sufficient gripping force. It is an office clip for pinching and binding paper, wherein a ring portion of elastic wire is spirally wound closely or at a predetermined pitch, with at least one end wire of the ring portion being extended inward with respect to the center of the spiral axis, and the end wire being bent toward the direction of the other end of the ring portion, heightening the clamping force and enhancing the designability by one motif created by the end wire.

Abstract: A letter producing system includes: a printing unit for performing printing on a paper sheet for enclosure and a paper sheet for envelope and outputting the paper sheet for enclosure before the paper sheet for envelope; an inserting and sealing unit for making an envelope from the paper sheet for envelope and inserting and sealing the paper sheet for enclosure in the envelope; an enclosure size obtaining section for obtaining size information of the enclosure; a paper output timing obtaining section for obtaining information of output timing of the first paper sheet for enclosure from the printing unit based on the size information of the enclosure; and a paper output control section for controlling timing of output of the first paper sheet for enclosure from the printing unit to the inserting and sealing unit based on the information of output timing.

Abstract: A letter producing system includes: a printing unit for performing printing on a paper sheet for enclosure and a paper sheet for envelope and outputting the paper sheet for enclosure before the paper sheet for envelope; an inserting and sealing unit for making an envelope from the paper sheet for envelope and inserting and sealing the paper sheet for enclosure in the envelope; an enclosure size obtaining section for obtaining size information of the enclosure; a paper output timing obtaining section for obtaining information of output timing of the first paper sheet for enclosure from the printing unit based on the size information of the enclosure; and a paper output control section for controlling timing of output of the first paper sheet for enclosure from the printing unit to the inserting and sealing unit based on the information of output timing.

Abstract: A clip is easily usable even by a visually handicapped person and a presbyope. The clip has bend sections, rectilinear sections, and a connection section. The bend sections can be located at positions close to each other with a spacing equal to or less than the diameter of the wire material of the clip held between them. The rectilinear sections are bent upward and some are in contact with each other.

Abstract: A clip easily usable even by a visually handicapped person and a presbyope. A clip (100) has first and second bend sections (110, 120), first and second rectilinear sections (130, 140), third and fourth rectilinear sections (150, 160), and a connection section (170). End edges (141, 151) of the second rectilinear section and the third rectilinear section, respectively, are positioned within a region surrounded by the first rectilinear section (130), the fourth rectilinear section (160), and the connection section (170). The first bend section (110) is located, in the longitudinal direction, at substantially the same position as the second bend section (120), or alternatively, the first bend section (110) and the second bend section (120) are located at positions close to each other with a spacing equal to or less than the diameter of the wire material of the clip held between them.

Abstract: A thin-film structural body formed by using a semiconductor processing technique and a manufacturing method thereof, and particularly a thin-film structural body constituting a semiconductor acceleration sensor and a manufacturing method thereof. The thin-film structural body allows the thin-film member to be easily stress-controlled, and easily makes the film-thickness of the thin-film member thicker. The thin-film member forms a mass body and, beams and fixed electrodes of the semiconductor acceleration sensor are constituted by a plurality of doped polysilicon thin-films that are laminated by performing a step of film deposition of polysilicon while, for example, phosphorous is being doped as impurities plural times.

Abstract: The present invention relates to a thin-film structural body formed by using a semiconductor processing technique and a manufacturing method thereof, and particularly in a thin-film structural body constituting a semiconductor acceleration sensor and a manufacturing method thereof, an object of the present invention is to provide a thin-film structural body which allows the thin-film member to be easily stress-controlled, and easily makes the film-thickness of the thin-film member thicker, and a manufacturing method thereof.