Abstract: The present invention provides a planer acoustic transducer including a vibrating diaphragm including a spiral voice coil provided on both surfaces or on one surface of an insulating base film; and a permanent magnet corresponding to the voice coil, wherein, in the vibrating diaphragm, the spiral voice coil is formed by applying a wire conductor, in a coil pattern, onto a sheet-like substrate having an adhesive layer on at least one surface thereof. Alternatively, at least a portion of the vibrating diaphragm, which portion corresponds to the loop of a first or second vibration mode, is reinforced with a rigidity-imparting member; the substrate of the vibrating diaphragm is formed of a resin foam; or the voice coil is formed three-dimensionally.

Abstract: The present invention provides a planer acoustic transducer including a vibrating diaphragm including a spiral voice coil provided on both surfaces or on one surface of an insulating base film; and a permanent magnet corresponding to the voice coil, wherein, in the vibrating diaphragm, the spiral voice coil is formed by applying a wire conductor, in a coil pattern, onto a sheet-like substrate having an adhesive layer on at least one surface thereof. Alternatively, at least a portion of the vibrating diaphragm, which portion corresponds to the loop of a first or second vibration mode, is reinforced with a rigidity-imparting member; the substrate of the vibrating diaphragm is formed of a resin foam; or the voice coil is formed three-dimensionally.

Abstract: A wiring system is provided. Using the system, a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head for guiding the wire conductor and the substrate such that the wiring head relatively moves along an adhesive layer on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact.

Abstract: A wiring method is provided, in which a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head (2) for guiding the wire conductor (5) and the substrate (11) such that the wiring head relatively moves along an adhesive layer (12) on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact. A wiring apparatus for carrying out the wiring method includes a table (1) for supporting the substrate, a wiring head arranged for reciprocating motion between a close position in which the wiring head can be in point contact with the adhesive layer and a distant position in which the wiring head is most distant from the adhesive layer, and a moving mechanism (3) for causing a translational motion of the wiring head along the surface of the substrate under the control of a control section (4).

Abstract: A wiring method is provided, in which a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head for guiding the wire conductor and the substrate such that the wiring head relatively moves along an adhesive layer on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact.

Abstract: A wiring method is provided, in which a wire conductor is stuck on a surface of a substrate by causing a three-dimensional relative movement between a wiring head (2) for guiding the wire conductor (5) and the substrate (11) such that the wiring head relatively moves along an adhesive layer (12) on the surface of the substrate and the wiring head and the adhesive layer intermittently come close to each other for point contact. A wiring apparatus for carrying out the wiring method includes a table (1) for supporting the substrate, a wiring head arranged for reciprocating motion between a close position in which the wiring head can be in point contact with the adhesive layer and a distant position in which the wiring head is most distant from the adhesive layer, and a moving mechanism (3) for causing a translational motion of the wiring head along the surface of the substrate under the control of a control section (4).