Patents by Inventor Masaaki Aramaki

Masaaki Aramaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230192949
    Abstract: A polycarbonate resin comprising a structural unit represented by the following formula (1), wherein weight-average molecular weight Mw measured by size-exclusion chromatography using polymethyl methacrylate as a standard sample is 50,000 or larger and 500,000 or smaller:
    Type: Application
    Filed: January 15, 2021
    Publication date: June 22, 2023
    Applicant: Asahi Kasei Kabushiki Kaisha
    Inventors: Tatsuro Toda, Hisanari Yoneda, Takuto Nakata, Shota Ide, Hiroshi Fukuoka, Katsuhiro Iwase, Masaaki Aramaki, Osamu Haba, Yusuke Tazawa
  • Patent number: 11548981
    Abstract: A polyphenylene ether having a predetermined structure.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: January 10, 2023
    Assignee: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Hiroshi Fukuoka, Shoji Otani, Katsuhiro Iwase, Masaaki Aramaki
  • Publication number: 20210024695
    Abstract: A polyphenylene ether having a predetermined structure.
    Type: Application
    Filed: March 29, 2019
    Publication date: January 28, 2021
    Applicant: ASAHI KASEI KABUSHIKI KAISHA
    Inventors: Hiroshi FUKUOKA, Shoji OTANI, Katsuhiro IWASE, Masaaki ARAMAKI
  • Patent number: 9115247
    Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: August 25, 2015
    Assignee: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
  • Patent number: 9023975
    Abstract: [Problem to be Solved] To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating. [Solution] This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60? equivalents/g.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: May 5, 2015
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Yu Nitto, Yasukazu Shikano, Shinji Ieda, Kazunori Terada, Masaaki Aramaki
  • Publication number: 20130281655
    Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.
    Type: Application
    Filed: June 19, 2013
    Publication date: October 24, 2013
    Inventors: Yasukazu SHIKANO, Teruaki SAKUMA, Hiroki MATSUI, Masaaki ARAMAKI, Yu NITTO, Shinji IEDA
  • Patent number: 8487024
    Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: July 16, 2013
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
  • Publication number: 20120165466
    Abstract: [Problem to be Solved] To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating. [Solution] This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60? equivalents/g.
    Type: Application
    Filed: September 7, 2010
    Publication date: June 28, 2012
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Yu Nitto, Yasukazu Shikano, Shinji Ieda, Kazunori Terada, Masaaki Aramaki
  • Patent number: 8017034
    Abstract: The present invention can provide a polyamide composition that is more excellent in the heat resistance and tensile elongation of molded products and also more excellent in a balance between these properties than those given by conventional polyamide compositions. The present invention relates to a polyamide composition comprising polyamide, liquid-crystalline polyester, and non-liquid-crystalline polyester, characterized in that Ma part by mass of the polyamide, Mb part by mass of the liquid-crystalline polyester, and Mc part by mass of the non-liquid-crystalline polyester with respect to 100 parts by mass in total of the polyamide, the liquid-crystalline polyester, and the non-liquid-crystalline polyester satisfy the following formulas: 60?Ma?90, 2?Mb?38, and 2?Mc?Ma×0.2?2.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: September 13, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Norio Sakata, Hiroshi Oyamada, Masaaki Aramaki
  • Patent number: 7960451
    Abstract: A polyamide masterbatch free from metal copper deposition and metal corrosion in an extruder or a molding machine, deterioration in mechanical physical properties of the product, and a color change of appearance due to water absorption and having improved heat aging resistance is produced by mixing, by melt kneading, a) 100 parts by weight of a polyamide having a water content of from 0.05 to 2.0 wt. %, b) from 0.1 to 10 parts by weight of an organic compound having at least one amide group, c) from 0.1 to 5 parts by weight of a copper compound having a maximum particle size of 50 ?m or less, and d) from 1 to 50 parts by weight of a halogen compound (with the proviso that a copper halide is excluded) having a maximum particle size of 50 ?m or less.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: June 14, 2011
    Assignee: Asahi Kasei Chemicals Corporation
    Inventor: Masaaki Aramaki
  • Publication number: 20110028614
    Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.
    Type: Application
    Filed: March 11, 2009
    Publication date: February 3, 2011
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
  • Publication number: 20090302272
    Abstract: The present invention can provide a polyamide composition that is more excellent in the heat resistance and tensile elongation of molded products and also more excellent in a balance between these properties than those given by conventional polyamide compositions. The present invention relates to a polyamide composition comprising polyamide, liquid-crystalline polyester, and non-liquid-crystalline polyester, characterized in that Ma part by mass of the polyamide, Mb part by mass of the liquid-crystalline polyester, and Mc part by mass of the non-liquid-crystalline polyester with respect to 100 parts by mass in total of the polyamide, the liquid-crystalline polyester, and the non-liquid-crystalline polyester satisfy the following formulas: 60?Ma?90, 2?Mb?38, and 2?Mc?Ma×0.2?2.
    Type: Application
    Filed: July 18, 2006
    Publication date: December 10, 2009
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Norio Sakata, Hiroshi Oyamada, Masaaki Aramaki
  • Publication number: 20090281210
    Abstract: A polyamide masterbatch free from metal copper deposition and metal corrosion in an extruder or a molding machine, deterioration in mechanical physical properties of the product, and a color change of appearance due to water absorption and having improved heat aging resistance is produced by mixing, by melt kneading, a) 100 parts by weight of a polyamide having a water content of from 0.05 to 2.0 wt. %, b) from 0.1 to 10 parts by weight of an organic compound having at least one amide group, c) from 0.1 to 5 parts by weight of a copper compound having a maximum particle size of 50 ?m or less, and d) from 1 to 50 parts by weight of a halogen compound (with the proviso that a copper halide is excluded) having a maximum particle size of 50 ?m or less.
    Type: Application
    Filed: April 10, 2007
    Publication date: November 12, 2009
    Applicant: Asahi Kasei Chemicals Corporation
    Inventor: Masaaki Aramaki
  • Patent number: 7491763
    Abstract: A polyamide composition has (a) a polyamide, (b) at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites, phosphoric esters, and phosphorous esters, and (c) a soluble metal aluminate compound represented by the general formula (M2O)x(Al2O3)y (wherein X+Y=1 and M is a Group 1 metal of the Periodic Table), wherein the molar ratio of polyvalent metal to monovalent metal in the composition (polyvalent metal/monovalent metal) is from 0.25 to 1.0.
    Type: Grant
    Filed: July 9, 2003
    Date of Patent: February 17, 2009
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Masaaki Aramaki, Asami Ohashi
  • Publication number: 20060142443
    Abstract: A polyamide composition has (a) a polyamide, (b) at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites, phosphoric esters, and phosphorous esters, and (c) a soluble metal aluminate compound represented by the general formula (M2O)x(Al2O3)y (wherein X+Y=1 and M is a Group 1 metal of the Periodic Table), wherein the molar ratio of polyvalent metal to monovalent metal in the composition (polyvalent metal/monovalent metal) is from 0.25 to 1.0.
    Type: Application
    Filed: July 9, 2003
    Publication date: June 29, 2006
    Inventors: Masaaki Aramaki, Asami Ohashi
  • Patent number: 7067577
    Abstract: The present invention relates to a resin composition comprising a resin and apatite, wherein referring to the particulate form of said apatite present in the resin composition thus obtained, the apatite is present in a particulate form having an average diameter or average thickness (d) of not greater than 100 nm and an average aspect ratio (L/D) of not smaller than 5 as defined by the ratio of the average length (L) to said average diameter or average thickness (d).
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: June 27, 2006
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Masaaki Aramaki, Kenya Sonobe
  • Patent number: 6936682
    Abstract: A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 to 97/3 and (b) an aliphatic diamine component is disclosed. The alicyclic polyamide having 1,4-cyclohexanedicarboxylic acid in a backbone thereof as a dicarboxylic acid unit, which is suitable as materials for various uses such as automotive parts, electric/electronics parts, industrial materials, engineering materials and daily household goods, and superior in heat resistance, low water absorption, light resistance, moldability and light weight, as well as superior in toughness, chemical resistance and appearance, and molded articles thereof.
    Type: Grant
    Filed: December 6, 2001
    Date of Patent: August 30, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Masaaki Aramaki, Tomofumi Maekawa
  • Patent number: 6890984
    Abstract: The present invention provides a polyamide resin composition suitable as industrial materials such as automobile parts, electronic or electrical parts, and industrial machine parts, and excellent in various mechanical properties such as various kinds of moldability, rigidity, and strength, and durability such as heat-resistant aging property. Namely, the invention relates to a polyamide resin composition comprising (A) a polyamide, (B) an apatite type compound, and (C) (i) a higher fatty acid metal salt and/or (ii) a mixture of a metal halide and a copper compound, wherein the polyamide resin composition is obtainable by adding component (C) after the formation of the apatite type compound.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: May 10, 2005
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Masaaki Aramaki, Katsushi Watanabe, Ikutoshi Nakashima
  • Patent number: 6794463
    Abstract: Block copolymer comprising at least two kinds of polymer components each having a different structural unit in the polymer selected from polyamide, polyester, polycarbonate and polyarylate. The present block copolymer has a distinguished moldability and can be produced even from rework products or recycle products in a simple and economical manner.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: September 21, 2004
    Assignee: Asahi Kasei Kabushiki Kaisha
    Inventors: Masaaki Aramaki, Takashi Saitou, Tomofumi Maekawa
  • Publication number: 20040049006
    Abstract: A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 to 97/3 and (b) an aliphatic diamine component is disclosed. The alicyclic polyamide having 1,4-cyclohexanedicarboxylic acid in a backbone thereof as a dicarboxylic acid unit, which is suitable as materials for various uses such as automotive parts, electric/electronics parts, industrial materials, engineering materials and daily household goods, and superior in heat resistance, low water absorption, light resistance, moldability and light weight, as well as superior in toughness, chemical resistance and appearance, and molded articles thereof.
    Type: Application
    Filed: June 10, 2003
    Publication date: March 11, 2004
    Inventors: Masaaki Aramaki, Tomofumi Maekawa