Patents by Inventor Masaaki Aramaki
Masaaki Aramaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230192949Abstract: A polycarbonate resin comprising a structural unit represented by the following formula (1), wherein weight-average molecular weight Mw measured by size-exclusion chromatography using polymethyl methacrylate as a standard sample is 50,000 or larger and 500,000 or smaller:Type: ApplicationFiled: January 15, 2021Publication date: June 22, 2023Applicant: Asahi Kasei Kabushiki KaishaInventors: Tatsuro Toda, Hisanari Yoneda, Takuto Nakata, Shota Ide, Hiroshi Fukuoka, Katsuhiro Iwase, Masaaki Aramaki, Osamu Haba, Yusuke Tazawa
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Patent number: 11548981Abstract: A polyphenylene ether having a predetermined structure.Type: GrantFiled: March 29, 2019Date of Patent: January 10, 2023Assignee: ASAHI KASEI KABUSHIKI KAISHAInventors: Hiroshi Fukuoka, Shoji Otani, Katsuhiro Iwase, Masaaki Aramaki
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Publication number: 20210024695Abstract: A polyphenylene ether having a predetermined structure.Type: ApplicationFiled: March 29, 2019Publication date: January 28, 2021Applicant: ASAHI KASEI KABUSHIKI KAISHAInventors: Hiroshi FUKUOKA, Shoji OTANI, Katsuhiro IWASE, Masaaki ARAMAKI
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Patent number: 9115247Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.Type: GrantFiled: June 19, 2013Date of Patent: August 25, 2015Assignee: ASAHI KASEI CHEMICALS CORPORATIONInventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
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Patent number: 9023975Abstract: [Problem to be Solved] To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating. [Solution] This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60? equivalents/g.Type: GrantFiled: September 7, 2010Date of Patent: May 5, 2015Assignee: Asahi Kasei Chemicals CorporationInventors: Yu Nitto, Yasukazu Shikano, Shinji Ieda, Kazunori Terada, Masaaki Aramaki
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Publication number: 20130281655Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.Type: ApplicationFiled: June 19, 2013Publication date: October 24, 2013Inventors: Yasukazu SHIKANO, Teruaki SAKUMA, Hiroki MATSUI, Masaaki ARAMAKI, Yu NITTO, Shinji IEDA
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Patent number: 8487024Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.Type: GrantFiled: March 11, 2009Date of Patent: July 16, 2013Assignee: Asahi Kasei Chemicals CorporationInventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
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Publication number: 20120165466Abstract: [Problem to be Solved] To provide a polyamide having a high melting point, which has excellent strength, toughness, and stability under heating. [Solution] This polyamide is obtained by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a pentamethylenediamine skeleton, wherein the polyamide has a cyclic amino end amount of 30 to 60? equivalents/g.Type: ApplicationFiled: September 7, 2010Publication date: June 28, 2012Applicant: ASAHI KASEI CHEMICALS CORPORATIONInventors: Yu Nitto, Yasukazu Shikano, Shinji Ieda, Kazunori Terada, Masaaki Aramaki
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Patent number: 8017034Abstract: The present invention can provide a polyamide composition that is more excellent in the heat resistance and tensile elongation of molded products and also more excellent in a balance between these properties than those given by conventional polyamide compositions. The present invention relates to a polyamide composition comprising polyamide, liquid-crystalline polyester, and non-liquid-crystalline polyester, characterized in that Ma part by mass of the polyamide, Mb part by mass of the liquid-crystalline polyester, and Mc part by mass of the non-liquid-crystalline polyester with respect to 100 parts by mass in total of the polyamide, the liquid-crystalline polyester, and the non-liquid-crystalline polyester satisfy the following formulas: 60?Ma?90, 2?Mb?38, and 2?Mc?Ma×0.2?2.Type: GrantFiled: July 18, 2006Date of Patent: September 13, 2011Assignee: Asahi Kasei Chemicals CorporationInventors: Norio Sakata, Hiroshi Oyamada, Masaaki Aramaki
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Patent number: 7960451Abstract: A polyamide masterbatch free from metal copper deposition and metal corrosion in an extruder or a molding machine, deterioration in mechanical physical properties of the product, and a color change of appearance due to water absorption and having improved heat aging resistance is produced by mixing, by melt kneading, a) 100 parts by weight of a polyamide having a water content of from 0.05 to 2.0 wt. %, b) from 0.1 to 10 parts by weight of an organic compound having at least one amide group, c) from 0.1 to 5 parts by weight of a copper compound having a maximum particle size of 50 ?m or less, and d) from 1 to 50 parts by weight of a halogen compound (with the proviso that a copper halide is excluded) having a maximum particle size of 50 ?m or less.Type: GrantFiled: April 10, 2007Date of Patent: June 14, 2011Assignee: Asahi Kasei Chemicals CorporationInventor: Masaaki Aramaki
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Publication number: 20110028614Abstract: The present invention relates to a polyamide obtainable by polymerizing an (a) dicarboxylic acid comprising at least 50 mol % of an alicyclic dicarboxylic acid and a (b) diamine comprising at least 50 mol % of a diamine having a substituent branched from a main chain.Type: ApplicationFiled: March 11, 2009Publication date: February 3, 2011Applicant: ASAHI KASEI CHEMICALS CORPORATIONInventors: Yasukazu Shikano, Teruaki Sakuma, Hiroki Matsui, Masaaki Aramaki, Yu Nitto, Shinji Ieda
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Publication number: 20090302272Abstract: The present invention can provide a polyamide composition that is more excellent in the heat resistance and tensile elongation of molded products and also more excellent in a balance between these properties than those given by conventional polyamide compositions. The present invention relates to a polyamide composition comprising polyamide, liquid-crystalline polyester, and non-liquid-crystalline polyester, characterized in that Ma part by mass of the polyamide, Mb part by mass of the liquid-crystalline polyester, and Mc part by mass of the non-liquid-crystalline polyester with respect to 100 parts by mass in total of the polyamide, the liquid-crystalline polyester, and the non-liquid-crystalline polyester satisfy the following formulas: 60?Ma?90, 2?Mb?38, and 2?Mc?Ma×0.2?2.Type: ApplicationFiled: July 18, 2006Publication date: December 10, 2009Applicant: ASAHI KASEI CHEMICALS CORPORATIONInventors: Norio Sakata, Hiroshi Oyamada, Masaaki Aramaki
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Publication number: 20090281210Abstract: A polyamide masterbatch free from metal copper deposition and metal corrosion in an extruder or a molding machine, deterioration in mechanical physical properties of the product, and a color change of appearance due to water absorption and having improved heat aging resistance is produced by mixing, by melt kneading, a) 100 parts by weight of a polyamide having a water content of from 0.05 to 2.0 wt. %, b) from 0.1 to 10 parts by weight of an organic compound having at least one amide group, c) from 0.1 to 5 parts by weight of a copper compound having a maximum particle size of 50 ?m or less, and d) from 1 to 50 parts by weight of a halogen compound (with the proviso that a copper halide is excluded) having a maximum particle size of 50 ?m or less.Type: ApplicationFiled: April 10, 2007Publication date: November 12, 2009Applicant: Asahi Kasei Chemicals CorporationInventor: Masaaki Aramaki
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Patent number: 7491763Abstract: A polyamide composition has (a) a polyamide, (b) at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites, phosphoric esters, and phosphorous esters, and (c) a soluble metal aluminate compound represented by the general formula (M2O)x(Al2O3)y (wherein X+Y=1 and M is a Group 1 metal of the Periodic Table), wherein the molar ratio of polyvalent metal to monovalent metal in the composition (polyvalent metal/monovalent metal) is from 0.25 to 1.0.Type: GrantFiled: July 9, 2003Date of Patent: February 17, 2009Assignee: Asahi Kasei Chemicals CorporationInventors: Masaaki Aramaki, Asami Ohashi
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Publication number: 20060142443Abstract: A polyamide composition has (a) a polyamide, (b) at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphorous acids, hypophosphorous acids, metal phosphates, metal phosphites, metal hypophosphites, phosphoric esters, and phosphorous esters, and (c) a soluble metal aluminate compound represented by the general formula (M2O)x(Al2O3)y (wherein X+Y=1 and M is a Group 1 metal of the Periodic Table), wherein the molar ratio of polyvalent metal to monovalent metal in the composition (polyvalent metal/monovalent metal) is from 0.25 to 1.0.Type: ApplicationFiled: July 9, 2003Publication date: June 29, 2006Inventors: Masaaki Aramaki, Asami Ohashi
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Patent number: 7067577Abstract: The present invention relates to a resin composition comprising a resin and apatite, wherein referring to the particulate form of said apatite present in the resin composition thus obtained, the apatite is present in a particulate form having an average diameter or average thickness (d) of not greater than 100 nm and an average aspect ratio (L/D) of not smaller than 5 as defined by the ratio of the average length (L) to said average diameter or average thickness (d).Type: GrantFiled: October 4, 2001Date of Patent: June 27, 2006Assignee: Asahi Kasei Kabushiki KaishaInventors: Masaaki Aramaki, Kenya Sonobe
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Patent number: 6936682Abstract: A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 to 97/3 and (b) an aliphatic diamine component is disclosed. The alicyclic polyamide having 1,4-cyclohexanedicarboxylic acid in a backbone thereof as a dicarboxylic acid unit, which is suitable as materials for various uses such as automotive parts, electric/electronics parts, industrial materials, engineering materials and daily household goods, and superior in heat resistance, low water absorption, light resistance, moldability and light weight, as well as superior in toughness, chemical resistance and appearance, and molded articles thereof.Type: GrantFiled: December 6, 2001Date of Patent: August 30, 2005Assignee: Asahi Kasei Kabushiki KaishaInventors: Masaaki Aramaki, Tomofumi Maekawa
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Patent number: 6890984Abstract: The present invention provides a polyamide resin composition suitable as industrial materials such as automobile parts, electronic or electrical parts, and industrial machine parts, and excellent in various mechanical properties such as various kinds of moldability, rigidity, and strength, and durability such as heat-resistant aging property. Namely, the invention relates to a polyamide resin composition comprising (A) a polyamide, (B) an apatite type compound, and (C) (i) a higher fatty acid metal salt and/or (ii) a mixture of a metal halide and a copper compound, wherein the polyamide resin composition is obtainable by adding component (C) after the formation of the apatite type compound.Type: GrantFiled: February 15, 2001Date of Patent: May 10, 2005Assignee: Asahi Kasei Kabushiki KaishaInventors: Masaaki Aramaki, Katsushi Watanabe, Ikutoshi Nakashima
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Patent number: 6794463Abstract: Block copolymer comprising at least two kinds of polymer components each having a different structural unit in the polymer selected from polyamide, polyester, polycarbonate and polyarylate. The present block copolymer has a distinguished moldability and can be produced even from rework products or recycle products in a simple and economical manner.Type: GrantFiled: September 27, 2002Date of Patent: September 21, 2004Assignee: Asahi Kasei Kabushiki KaishaInventors: Masaaki Aramaki, Takashi Saitou, Tomofumi Maekawa
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Publication number: 20040049006Abstract: A polyamide characterized in that the polyamide is obtained by thermal polycondensation of (a) dicarboxylic acid components comprising 10 to 80% by mole in total carboxylic acid components of 1,4-cyclohexanedicarboxylic acid having a trans/cis molar ratio of 50/50 to 97/3 and (b) an aliphatic diamine component is disclosed. The alicyclic polyamide having 1,4-cyclohexanedicarboxylic acid in a backbone thereof as a dicarboxylic acid unit, which is suitable as materials for various uses such as automotive parts, electric/electronics parts, industrial materials, engineering materials and daily household goods, and superior in heat resistance, low water absorption, light resistance, moldability and light weight, as well as superior in toughness, chemical resistance and appearance, and molded articles thereof.Type: ApplicationFiled: June 10, 2003Publication date: March 11, 2004Inventors: Masaaki Aramaki, Tomofumi Maekawa