Patents by Inventor Masaaki Hagiwara

Masaaki Hagiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11052645
    Abstract: Provided is a thermoplastic resin film having at least one of film surfaces being excellent in printability, having sufficiently low internal haze, and exhibiting a favorable matte appearance. A thermoplastic resin film according to the present invention composed of a thermoplastic resin composition (C) including at least one kind of a thermoplastic resin (R) and fine particles (P) having a volume average particle diameter of 0.5 to 15 ?m and a refractive index different from that of the thermoplastic resin (R) by 0.02 or more. At least one of film surfaces satisfies formulas (1) and (2). GL?60??(1), GL?35?GH?GL?10??(2) (In the formulas (1) and (2), GL is 60° gloss (%) at 20° C., GH is 60° gloss (%) when the thermoplastic resin film is heated at a temperature 10° C. higher than a glass transition temperature of the thermoplastic resin composition (C) for 30 minutes, then cooled to 20° C.).
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: July 6, 2021
    Assignee: KURARAY CO., LTD.
    Inventors: Wataru Tsuji, Takao Hoshiba, Nariaki Fujii, Masaaki Hagiwara
  • Publication number: 20190055393
    Abstract: Provided is a thermoplastic resin film having at least one of film surfaces being excellent in printability, having sufficiently low internal haze, and exhibiting a favorable matte appearance. A thermoplastic resin film according to the present invention composed of a thermoplastic resin composition (C) including at least one kind of a thermoplastic resin (R) and fine particles (P) having a volume average particle diameter of 0.5 to 15 ?m and a refractive index different from that of the thermoplastic resin (R) by 0.02 or more. At least one of film surfaces satisfies formulas (1) and (2). GL?60??(1), GL?35?GH?GL?10??(2) (In the formulas (1) and (2), GL is 60° gloss (%) at 20° C., GH is 60° gloss (%) when the thermoplastic resin film is heated at a temperature 10° C. higher than a glass transition temperature of the thermoplastic resin composition (C) for 30 minutes, then cooled to 20° C.
    Type: Application
    Filed: February 13, 2017
    Publication date: February 21, 2019
    Applicant: KURARAY CO., LTD.
    Inventors: Wataru TSUJI, Takao HOSHIBA, Nariaki FUJII, Masaaki HAGIWARA
  • Patent number: 8296097
    Abstract: An unmoldability determination apparatus includes: a normal line calculation unit that calculates a normal line extending from a point on the surfaces of a three-dimensional shape of a molded product; an opposite direction component determination unit that determines whether the normal line calculated on each surface has a directional component opposite to a mold release direction of a mold of the molded product; a reach determination unit that determines whether there is another surface on the molded product which either a line extending from a projection surface in the mold release direction or a line opposite to the mold release direction reaches; and an unmoldability determination unit that, when there is another surface which both lines extending from the projection surface reach, determines the projection surface to be unreleasable from the mold by moving the mold in the mold release direction, thus determining the projection surface to be unmoldable.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: October 23, 2012
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Toshihiro Numauchi, Masaaki Hagiwara, Hiroaki Nakazato, Katsumi Takezaki
  • Patent number: 8243063
    Abstract: A shape inspection apparatus includes a shape display unit that displays a three-dimensional shape specified by three dimensional shape data on a screen; a direction designating unit that specifies a drawing direction in molding the three-dimensional shape on the screen; a face designating unit that specifies one face of a protruding or recessed shape portion of the three-dimensional shape on the screen; a dimension calculating unit that calculates a shape dimensional value of the shape portion based on the specified drawing direction and the specified one face; and a determination unit that determines whether or not the shape portion having the shape dimensional value satisfies a shape condition by comparing the calculated shape dimensional value with a standard value.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: August 14, 2012
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Hiroaki Nakazato, Masaaki Hagiwara, Toshihiro Numauchi, Katsumi Takezaki
  • Patent number: 8185361
    Abstract: An unmoldable portion detection system includes: a normal line arithmetic unit; a backward component determination unit; and an unmoldable portion determination unit, wherein the system further includes one of the following (A) units and (B) units: (A) a concave connection determination unit; and an adjacent unmoldable portion determination unit, and (B) a projection line reach determination unit; and a projection unmoldable portion determination unit.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: May 22, 2012
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Hiroaki Nakazato, Masaaki Hagiwara, Katsumi Takezaki, Toshihiro Numauchi
  • Publication number: 20110071790
    Abstract: An unmoldability determination apparatus includes: a normal line calculation unit that calculates a normal line extending from a point on each of surfaces constituting a three-dimensional shape of a molded product; an opposite direction component determination unit that determines whether or not the normal line calculated on each surface has an opposite direction component which is a directional component opposite to a mold release direction of a mold of the molded product prescribed for the each surface; a reach determination unit that, when a surface having a point at which the normal line having the opposite direction component is calculated is a projection surface, determines whether or not there is another surface on the molded product which one of a line extending from the projection surface in the mold release direction and a line extending in a direction opposite to the mold release direction reaches; and an unmoldability determination unit that, when there is another surface which both of the line ex
    Type: Application
    Filed: April 21, 2010
    Publication date: March 24, 2011
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Toshihiro NUMAUCHI, Masaaki Hagiwara, Hiroaki Nakazato, Katsumi Takezaki
  • Publication number: 20090129662
    Abstract: A shape inspection apparatus includes a shape display unit that displays a three-dimensional shape specified by three dimensional shape data on a screen; a direction designating unit that specifies a drawing direction in molding the three-dimensional shape on the screen; a face designating unit that specifies one face of a protruding or recessed shape portion of the three-dimensional shape on the screen; a dimension calculating unit that calculates a shape dimensional value of the shape portion based on the specified drawing direction and the specified one face; and a determination unit that determines whether or not the shape portion having the shape dimensional value satisfies a shape condition by comparing the calculated shape dimensional value with a standard value.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 21, 2009
    Inventors: Hiroaki Nakazato, Masaaki Hagiwara, Toshihiro Numauchi, Katsumi Takezaki
  • Publication number: 20090125284
    Abstract: An unmoldable portion detection system includes: a normal line arithmetic unit; a backward component determination unit; and an unmoldable portion determination unit, wherein the system further includes one of the following (A) units and (B) units: (A) a concave connection determination unit; and an adjacent unmoldable portion determination unit, and (B) a projection line reach determination unit; and a projection unmoldable portion determination unit.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 14, 2009
    Inventors: Hiroaki Nakazato, Masaaki Hagiwara, Katsumi Takezaki, Toshihiro Numauchi
  • Patent number: 7169440
    Abstract: A method is provided for plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an oxygen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluoro-carbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: January 30, 2007
    Assignee: Tokyo Electron Limited
    Inventors: Vaidyanathan Balasubramaniam, Masaaki Hagiwara, Eiichi Nishimura, Kouichiro Inazawa
  • Patent number: 6849559
    Abstract: A method is provided for plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an hydrogen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluoro-carbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: February 1, 2005
    Assignee: Tokyo Electron Limited
    Inventors: Vaidyanathan Balasubramaniam, Yasunori Hatamura, Masaaki Hagiwara, Eiichi Nishimura, Kouichiro Inazawa
  • Patent number: 6737350
    Abstract: A semiconductor device using, e.g., a fluorine containing carbon film, as an interlayer dielectric film is produced by a dual damascene method which is a simple technique. After an dielectric film, e.g., an SiO2 film 3, is deposited on a substrate 2, the SiO2 film 3 is etched to form a via hole 31 therein, and then, a top dielectric film, e.g., a CF film 4, is deposited on the top face of the SiO2 film 3. If the CF film is deposited by activating a thin-film deposition material having a bad embedded material, e.g., C6F6 gas, as a plasma, the CF film 4 can be deposited on the top face of the SiO2 film 3 while inhibiting the CF film from being embedded into the via hole 31. Subsequently, by etching the CF film 4 to form a groove 41 therein, it is possible to easily produce a dual damascene shape wherein the groove 41 is integrated with the via hole 31.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: May 18, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Takashi Akahori, Kouichiro Inazawa, Kouji Senoo, Masaaki Hagiwara
  • Publication number: 20030192856
    Abstract: A method is provided for plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an oxygen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluorocarbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.
    Type: Application
    Filed: September 30, 2002
    Publication date: October 16, 2003
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Vaidyanathan Balasubramaniam, Masaaki Hagiwara, Eiichi Nishimura, Kouichiro Inazawa
  • Publication number: 20030194876
    Abstract: A method is provided for plasma ashing to remove photoresist remnants and etch residues that are formed during preceding plasma etching of dielectric layers. The ashing method uses a two-step plasma process involving an hydrogen-containing gas, where low or zero bias is applied to the substrate in the first cleaning step to remove significant amount of photoresist remnants and etch residues from the substrate, in addition to etching and removing detrimental fluoro-carbon residues from the chamber surfaces. An increased bias is applied to the substrate in the second cleaning step to remove the remains of the photoresist and etch residues from the substrate. The two-step process reduces the memory effect commonly observed in conventional one-step ashing processes. A method of endpoint detection can be used to monitor the ashing process.
    Type: Application
    Filed: September 30, 2002
    Publication date: October 16, 2003
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Vaidyanathan Balasubramaniam, Yasunori Hatamura, Masaaki Hagiwara, Eiichi Nishimura, Kouichiro Inazawa
  • Patent number: 5840157
    Abstract: A deinking agent comprising a compound represented by the following general formula I is herein provided:R.sup.1 O--(PO)m--(EO)n--(XO)k--R.sup.2 (I)(wherein R.sup.1 represents an alkyl or alkenyl group having 12 to 22 carbon atoms; R.sup.2 represents a hydrogen atom or an acyl group having 2 to 24 carbon atoms; PO, EO and XO represent a propylene oxide unit, an ethylene oxide unit and an alkylene oxide unit having not less than 3 cabon atoms, respectively; m=1.about.8; n=10.about.40; and k is such a number that the number of total carbon atoms present in the polymerized XO unit ranges from 3 to 120; the PO and EO in Formula (I) being added through block-addition). The use of the deinking agent in the deinking methods, in particular, the flotation method permits the preparation of high quality reclaimed pulp having high brightness and a low content of residual ink and also ensures stable operations for the methods.
    Type: Grant
    Filed: July 22, 1994
    Date of Patent: November 24, 1998
    Assignee: Lion Corporation
    Inventors: Masaaki Hagiwara, Yoshie Hirakouchi
  • Patent number: 5762447
    Abstract: In order to provide an integral whole unit for continuously measuring the quantity of heat needed to melt snow lying on a road, and prevent freezing of the road; and for controlling a supply of heat to the road for melting the snow lying on the road and for preventing the freezing of the road, it uses a road-simulated device. The road-simulated device is put outdoors while it is snowing, and it is heated and kept at a temperature of -0.degree. C., thus keeping the road-simulated surface free of snows, and preventing the freezing of the road-simulated surface. In this condition the thermal energy required to keep the simulated road surface unfrozen is determined, and every control variable is determined on the basis of this so determined thermal energy.
    Type: Grant
    Filed: January 6, 1997
    Date of Patent: June 9, 1998
    Assignee: Kohtaro Hashimoto
    Inventors: Kunio Hachiki, Junichi Yamazaki, Tadayuki Yamada, Satoshi Yasumoto, Masaaki Hagiwara
  • Patent number: 5417808
    Abstract: A deinking composition for regeneration of waste paper by floatation comprises 99.7 to 97% by weight of a mixture which comprises monoalkyl ethers of ethylene oxide/propylene oxide copolymers represented by the following general formulas (A) and (B) and the mixing ratio of the compound (A) to the compound (B) ranges from 10:90 to 90:10 (weight ratio); and about 0.3 to about 3.0% by weight of a polyoxyalkylene oxide selected from the group consisting of polyethylene oxides, polypropylene oxide and ethylene oxide/propylene oxide copolymers:R.sup.1 O-(PO).sub.n1 -[(EO).sub.m.(PO).sub.n2 ]-H (A)R.sup.2 O-(EO).sub.m1 -[(EO).sub.m2.(PO).sub.n ]-H (B)wherein m/(n1+n2) ranges from 0.5 to 1.5; (m1+m2)/n ranges from 1.1 to 2.0; EO and PO represent ethylene oxide and propylene oxide units respectively; and the EO and PO in the brackets may be in either a random or block configuration. The deinking composition exhibits excellent deinking properties.
    Type: Grant
    Filed: February 1, 1993
    Date of Patent: May 23, 1995
    Assignee: Lion Corporation
    Inventors: Yataka Okamoto, Yoshie Hirakouchi, Masaaki Hagiwara
  • Patent number: 4544033
    Abstract: A process for recovering oil from an oil-bearing subterranean reservoir penetrated by at least one injection well and at least one production well which comprises the steps of:(1) injecting into the oil-bearing subterranean reservoir through the injection well a first injecting fluid consisting essentially of (a) 1% to 30% by weight of an internal olefin sulfonate having 10 to 26 carbon atoms and a disulfonate content of 20% by weight or less, (b) 0.1% to 20% by weight of a cosurfactant, and (c) a brine;(2) injecting, as a second injecting fluid, an aqueous polymer solution having a viscosity higher than that of the first injecting fluid into the oil-bearing subterranean reservoir; and(3) recovering oil replaced with the first and second injecting fluids through the production well.
    Type: Grant
    Filed: March 23, 1984
    Date of Patent: October 1, 1985
    Assignee: Lion Corporation
    Inventors: Toshiyuki Ukigai, Masaaki Hagiwara, Junichi Yamada