Patents by Inventor Masaaki Hanamura
Masaaki Hanamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9541827Abstract: It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH2OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).Type: GrantFiled: January 29, 2014Date of Patent: January 10, 2017Assignee: JSR CorporationInventors: Tomohiko Sakurai, Masaaki Hanamura
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Publication number: 20140234777Abstract: It is an object of the present invention to improve the curability of a resin composition and a photosensitive composition suitably employed to form e.g., a surface protecting film and an interlaminar insulating film of e.g., an electronic part, while reducing the internal stress remaining in a substrate when the composition is used to form a cured film on the substrate. The photosensitive composition includes a resin (A) having a phenolic hydroxyl group, a crosslinking agent (B1) having at least two oxazoline groups and a crosslinking agent (B2) having at least two groups represented by —CH2OR (wherein R is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an acetyl group) and a photosensitive acid-generating agent (C).Type: ApplicationFiled: January 29, 2014Publication date: August 21, 2014Applicant: JSR CORPORATIONInventors: Tomohiko SAKURAI, Masaaki HANAMURA
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Patent number: 8486604Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.Type: GrantFiled: June 29, 2010Date of Patent: July 16, 2013Assignee: JSR CorporationInventors: Masaaki Hanamura, Daigo Ichinohe, Hideaki Takase
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Patent number: 8443870Abstract: A steam heat exchanger includes a steam heating pipe with a condensation pipe part and a sensible heat pipe part provided on the lower side of the condensation pipe part. In the condensation pipe part, a liquid is heated by latent heat. The drain discharge capacity in a steam trap or an orifice disposed on the drain discharge side equals the amount of condensation at the service temperature of the steam heat exchanger. Condensed water produced after the heat exchange in the condensation pipe part enters the sensible heat pipe part on the downstream side to hold the sensible heat pipe part in a water sealed state. In this sensible heat pipe part, the liquid is heated by sensible heat. Heat exchange efficiency is improved by using latent and sensible heat, the amount of steam used can be reduced, and the load of a steam generation source can be reduced.Type: GrantFiled: November 16, 2006Date of Patent: May 21, 2013Inventor: Masaaki Hanamura
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Publication number: 20130012618Abstract: Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent, wherein in the formula (a1), R1s are each independently a hydrogen atom or hydroxyl group, provided that at least one R1 is hydroxyl group; and R2 is a hydrogen atom or a C1-4 alkyl group; and in the formula (a2), R3s are each independently a group having a cationic polymerizable group, or a hydrogen atom, provided that at least one R3 is a group having a cationic polymerizable group; and R4 is a hydrogen atom or a C1-4 alkyl group.Type: ApplicationFiled: July 3, 2012Publication date: January 10, 2013Applicant: JSR CorporationInventors: Akito HIRO, Masaaki HANAMURA, Futoshi YAMATO, Yuuji SHIMOYAMA, Jun MUKAWA, Hikaru MIZUNO, Akari SAKO, Tomohiko SAKURAI
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Publication number: 20120296053Abstract: A photosensitive composition capable of forming a cured film having small internal stress; a cured film formed from the composition; and an electronic part including the cured film. The photosensitive composition includes: an alkali soluble resin (A), which includes at least 80% by mass of a novolak resin; a photosensitive compound (B); and a crosslinking agent (C), which includes at least a compound represented by the following formula (C1): wherein R1 is an alkyl group having 1 to 6 carbon atoms or the like; R2 is hydroxyl group or the like; R3 is a (a+1)valent hydrocarbon group or the like; R5 is a (c+1)valent hydrocarbon group or the like; R4 is a single bond or the like; a and c are each independently integers of 1 to 3, wherein the sum a+c is an integer of 3 to 6; and b is an integer of 0 or more.Type: ApplicationFiled: April 18, 2012Publication date: November 22, 2012Applicant: JSR CORPORATIONInventors: Masaaki HANAMURA, Futoshi YAMATO, Akito HIRO, Akari SAKO, Jun MUKAWA
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Publication number: 20110008730Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.Type: ApplicationFiled: June 29, 2010Publication date: January 13, 2011Applicant: JSR CORPORATIONInventors: Masaaki HANAMURA, Daigo Ichinohe, Hideaki Takase
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Publication number: 20090107659Abstract: A steam heat exchanger includes a steam heating pipe with a condensation pipe part and a sensible heat pipe part provided on the lower side of the condensation pipe part. In the condensation pipe part, a liquid is heated by latent heat. The drain discharge capacity in a steam trap or an orifice disposed on the drain discharge side equals the amount of condensation at the service temperature of the steam heat exchanger. Condensed water produced after the heat exchange in the condensation pipe part enters the sensible heat pipe part on the downstream side to hold the sensible heat pipe part in a water sealed state. In this sensible heat pipe part, the liquid is heated by sensible heat. Heat exchange efficiency is improved by using latent and sensible heat, the amount of steam used can be reduced, and the load of a steam generation source can be reduced.Type: ApplicationFiled: November 17, 2005Publication date: April 30, 2009Inventor: Masaaki Hanamura
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Publication number: 20080213692Abstract: A radiation sensitive composition containing inorganic oxide particles; a copolymer of at least one unsaturated compound selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride and other unsaturated compound different from the unsaturated compound; a polyfunctional unsaturated compound having at least two ethylenically unsaturated groups in the molecule; and a radiation sensitive polymerization initiator. The composition is useful for making a microlens.Type: ApplicationFiled: April 17, 2008Publication date: September 4, 2008Applicant: JSR CORPORATIONInventor: Masaaki HANAMURA
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Patent number: 7378224Abstract: There is provided a method for forming a pattern comprising two regions of different refractive indices easily, that is, a method comprising the steps of forming a pattern having a water-shedding oil-shedding region by use of a radiation sensitive resin composition and coating the pattern with a high refractive index resin solution using a solvent having low wettability to the water-shedding oil-shedding region so as to form two regions of different refractive indices.Type: GrantFiled: July 13, 2004Date of Patent: May 27, 2008Assignee: JSR CorporationInventors: Masaaki Hanamura, Shinji Shiraki, Atsushi Kumano
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Patent number: 7374799Abstract: A radiation sensitive composition containing inorganic oxide particles; a copolymer of at least one unsaturated compound selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride and other unsaturated compound different from the unsaturated compound; a polyfunctional unsaturated compound having at least two ethylenically unsaturated groups in the molecule; and a radiation sensitive polymerization initiator. The composition is useful for making a microlens.Type: GrantFiled: December 15, 2004Date of Patent: May 20, 2008Assignee: JSR CorporationInventor: Masaaki Hanamura
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Patent number: 7320854Abstract: There is provided a radiation sensitive refractive index changing composition containing an inorganic oxide particle, a polymerizable compound, a radiation sensitive decomposer and an escapable compound. The radiation sensitive decomposer decomposes upon exposure to radiation to form an acid, base or radical, and this decomposed product increases the molecular weight of the polymerizable compound.Type: GrantFiled: June 24, 2004Date of Patent: January 22, 2008Assignee: JSR CorporationInventors: Masaaki Hanamura, Michinori Nishikawa, Atsushi Kumano
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Patent number: 7186448Abstract: The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.Type: GrantFiled: May 12, 2003Date of Patent: March 6, 2007Assignee: JSR CorporationInventors: Yasuaki Yokoyama, Nobuo Bessho, Masaaki Hanamura
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Publication number: 20060275939Abstract: The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.Type: ApplicationFiled: August 10, 2006Publication date: December 7, 2006Applicant: JSR CorporationInventors: Yasuaki Yokoyama, Nobuo Bessho, Masaaki Hanamura
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Publication number: 20060008735Abstract: A radiation sensitive resin composition which contains (A) an alkali soluble polymer of a polymerizable mixture containing (a) 10 to 50 wt % of polymerizable unsaturated compound having an acid functional group, (b) 20 to 60 wt % of polymerizable unsaturated compound having an alicyclic hydrocarbon group and no acid functional group, and (c) 5 to 40 wt % of other polymerizable unsaturated compound, said wt % being based on the total of these components (a), (b) and (c), (B) a polymerizable unsaturated compound, (C) a photopolymerization initiator, and (D) a thermal polymerizable compound. The composition is used for forming a microlens.Type: ApplicationFiled: July 7, 2005Publication date: January 12, 2006Applicant: JSR CORPORATIONInventor: Masaaki Hanamura
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Publication number: 20050157399Abstract: A radiation sensitive composition containing inorganic oxide particles; a copolymer of at least one unsaturated compound selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride and other unsaturated compound different from the unsaturated compound; a polyfunctional unsaturated compound having at least two ethylenically unsaturated groups in the molecule; and a radiation sensitive polymerization initiator. The composition is useful for making a microlens.Type: ApplicationFiled: December 15, 2004Publication date: July 21, 2005Applicant: JSR CORPORATIONInventor: Masaaki Hanamura
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Publication number: 20050014100Abstract: There is provided a method for forming a pattern comprising two regions of different refractive indices easily, that is, a method comprising the steps of forming a pattern having a water-shedding oil-shedding region by use of a radiation sensitive resin composition and coating the pattern with a high refractive index resin solution using a solvent having low wettability to the water-shedding oil-shedding region so as to form two regions of different refractive indices.Type: ApplicationFiled: July 13, 2004Publication date: January 20, 2005Applicant: JSR CorporationInventors: Masaaki Hanamura, Shinji Shiraki, Atsushi Kumano
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Publication number: 20040265737Abstract: There is provided a radiation sensitive refractive index changing composition containing an inorganic oxide particle, a polymerizable compound, a radiation sensitive decomposer and an escapable compound. The radiation sensitive decomposer decomposes upon exposure to radiation to form an acid, base or radical, and this decomposed product increases the molecular weight of the polymerizable compound.Type: ApplicationFiled: June 24, 2004Publication date: December 30, 2004Applicant: JSR CORPORATIONInventors: Masaaki Hanamura, Michinori Nishikawa, Atsushi Kumano
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Publication number: 20040185187Abstract: The present invention relates to a method of temporarily and firmly fixing two solids to each other and to a composition used in the method, which is a method of temporarily fixing, comprising temporarily fixing the two solids to each other with a liquid crystal compound or a composition comprising the liquid crystal compound. This method is used for a method of temporarily fixing a pad for chemical mechanical polishing, for example, to polish a wafer for a semiconductor device fixed on a surface of a base plate, when one solid is a pad for chemical mechanical polishing of a wafer for a semiconductor device and the other is a base plate to fix the pad.Type: ApplicationFiled: January 9, 2004Publication date: September 23, 2004Inventors: Yasuaki Yokoyama, Nobuo Bessho, Masaaki Hanamura