Abstract: A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.

Abstract: A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper or lower surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.

Abstract: A semiconductor device includes a semiconductor chip having a main surface formed with an electrode pad, a package containing the semiconductor chip, a component element connected with the electrode pad within the package, a gold bump formed on the electrode pad, and a gold connecting member. The gold connecting member has an end bonded to the gold bump, and the other end bonded to the component.

Abstract: A semiconductor device includes a semiconductor chip having a main surface formed with an electrode pad, a package containing the semiconductor chip, a component element connected with the electrode pad within the package, a gold bump formed on the electrode pad, and a gold connecting member. The gold connecting member has an end bonded to the gold bump, and the other end bonded to the component.

Abstract: A semiconductor device is provided which includes an upper semiconductor chip and a lower semiconductor chip attached to the upper semiconductor chip. The upper semiconductor chip is formed with a first connection pad, while the lower semiconductor chip is formed with a second connection pad. The semiconductor device also includes a deformable stud bump made of gold and arranged between the first and the second connection pads. The deformable stud bump includes an upwardly pointed portion before it is pressed and deformed by the first connection pad of the upper semiconductor chip. The pointed portion serves to break through an oxide film formed on the first connection pad of the upper semiconductor chip. The semiconductor device further includes an adhesive resin layer applied between the upper and lower semiconductor chips.