Abstract: The present invention relates to a boric-acid free nickel plating composition which does not include organic carboxylic acid but has high bath-pH-stability. The nickel plating composition provides a nickel plating film suitable for the use of electronic components.

Abstract: To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.

Abstract: A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating method.

Abstract: To provide a tin electroplating solution devoid of harmful lead and having excellent solder wettability, and a method for depositing a tin film on electronic parts using such a tin electroplating solution. The tin electroplating solution includes organic acids, a naphtholsulfonic acid and, as needed, an antioxidant and a surfactant is disclosed.

Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.

Abstract: This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 ?m or less, can be prepared that is otherwise difficult to prepare using conventional methods.

Abstract: This invention provides a process for electroless copper plating without using formaldehyde and an electroless copper plating solution which is used in the process. To this end, there is disclosed a process for electroless copper plating, which treatment comprises depositing a palladium or palladium-tin catalyst on a resin substrate, and then treating said resin substrate having the catalyst deposited thereon with a formaldehyde-free electroless copper plating solution that contains copper ions and a reducing agent, wherein the need for an accelerating treatment of a catalyst after said catalyst depositing treatment is obviated. The productivity of a copper-resin composite material is dramatically enhanced by the process of the present invention, because a copper thin layer can be formed on the resin substrate in a short time, even if an accelerating treatment for a catalyst is not performed in a separate process.

Abstract: A resin composite material which comprises a resin base and a metal-element-containing ingredient disposed on the surface of the base and is obtained by a wet process, characterized by having no catalyst layers. The resin composite material is superior in adhesion between the resin base and the metal-element-containing ingredient and in evenness of the thickness of the metal-element-containing coating film to the resin composite materials obtained by conventional wet processes. The formation of the resin composite material necessitates neither etching nor electroless plating unlike the conventional wet processes. Consequently, the resin composite material can be easily produced without causing pollution attributable to these treatments, such as working atmosphere worsening and the pollution of the global environment.

Abstract: A composite material having metal at the surface of a resin base is obtained by subjecting the surface of a resin base to ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions to introduce metal ions, introducing photocatalyst into the resin base containing said introduced metal ions, and then irradiating the resin base with electromagnetic radiation after said photocatalyst introduction. Said composite material is useful for composite materials that require fine metal patterns.

Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.

Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.

Abstract: This invention offers a method for forming a resin composite material, containing the steps of: (1) treating the surface of a carrier resin to treatment introduce ion exchange groups, (2) introducing metal ions to treat the carrier resin surface by treating the surface of said carrier resin with a solution containing metal ions, (3) converting said metal ions to a component containing a metal element, (4) forming a metal foil on top of said component containing a metal element, and (5) transferring said metal foil to a resin substrate by heating said metal foil. This method provides a carrier resin substrate having a metal foil of any desired thickness laminated or cast onto it. In this way a carrier resin containing a metal foil, particularly a copper foil, having a thickness, such as 8 &mgr;m or less, can be prepared that is otherwise difficult to prepare using conventional methods.

Abstract: A method for forming copper-resin composite materials is disclosed. This method affixes a palladium or palladium-tin catalyst onto resin substrate, and then subjects the catalyst-containing resin to an electroless copper plating bath without performing a catalyst acceleration treatment step.

Abstract: The present invention offers a non-charging resin composite material and method for manufacturing said resin composite material. In particular, a non-charging resin composite material can be manufactured by using liquid containing metal ions to treat the surface of a resin base treated with ion-exchange group introduction agent, thereby introducing metal ions. By then converting said metal ions, a component containing metal element is introduced at the surface of the resin base in such a small amount that charging of the resin base can be prevented, without increasing the low conductivity intrinsic to the resin base to above a certain level, which has been difficult in the past. With said non-charging resin composite material, damage due to the adhesion of dirt or dust on the base is prevented, as is damage to the base caused by static electricity resulting from charging.