Patents by Inventor Masaaki Izaki

Masaaki Izaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of detinning Sn plating layer on Cu-based material
    Patent number: 8262769
    Abstract: A Cu-based material 5 is immersed into an alkali hydroxide solution with a concentration of 3.0 to 37.5 mass % and a H2O2 solution with a concentration of 3.0 to 50.0 mass % is added in the alkali hydroxide solution, a temperature of the alkali hydroxide solution when the Cu-based material is immersed ranges from 60 to 105° C., a ratio A/B between a mol number A of alkali hydroxide in the alkali hydroxide solution and a mol number B of H2O2 in the H2O2 solution is 10 or more, and where a mol number of Sn in the Sn layer is C and a mol number of Sn in the CuSn layer is D, B?C×2+D×6.
    Type: Grant
    Filed: December 10, 2010
    Date of Patent: September 11, 2012
    Assignee: Dowa Metaltech Co., Ltd
    Inventors: Hiroto Narieda, Yuta Sonoda, Masaaki Izaki
  • Method of detinning Sn plating layer on Cu-based material
    Publication number: 20110138966
    Abstract: A Cu-based material 5 is immersed into an alkali hydroxide solution with a concentration of 3.0 to 37.5 mass % and a H2O2 solution with a concentration of 3.0 to 50.0 mass % is added in the alkali hydroxide solution, a temperature of the alkali hydroxide solution when the Cu-based material is immersed ranges from 60 to 105° C., a ratio A/B between a mol number A of alkali hydroxide in the alkali hydroxide solution and a mol number B of H2O2 in the H2O2 solution is 10 or more, and where a mol number of Sn in the Sn layer is C and a mol number of Sn in the CuSn layer is D, B?C×2+D×6.
    Type: Application
    Filed: December 10, 2010
    Publication date: June 16, 2011
    Applicant: DOWA METALTECH CO., LTD
    Inventors: Hiroto Narieda, Yuta Sonoda, Masaaki Izaki