Patents by Inventor Masaaki Kanae
Masaaki Kanae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10593861Abstract: Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substrate 2, a driver portion 3 formed on one of the principle surfaces of the device substrate 2, a protection portion 4 configured to cover the driver portion 3 so as to form a hollowed space 8 around the driver portion 3, an adhesion layer 10 that is made of a resin and arranged above the protection portion 4, and a reinforcing plate 11 arranged on the adhesion layer 10, wherein the reinforcing plate 11 is a silicon substrate.Type: GrantFiled: June 14, 2017Date of Patent: March 17, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masaaki Kanae
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Patent number: 10312880Abstract: A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.Type: GrantFiled: January 20, 2017Date of Patent: June 4, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masaaki Kanae
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Publication number: 20170279030Abstract: Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substrate 2, a driver portion 3 formed on one of the principle surfaces of the device substrate 2, a protection portion 4 configured to cover the driver portion 3 so as to form a hollowed space 8 around the driver portion 3, an adhesion layer 10 that is made of a resin and arranged above the protection portion 4, and a reinforcing plate 11 arranged on the adhesion layer 10, wherein the reinforcing plate 11 is a silicon substrate.Type: ApplicationFiled: June 14, 2017Publication date: September 28, 2017Inventor: Masaaki Kanae
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Patent number: 9711708Abstract: Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substrate 2, a driver portion 3 formed on one of the principle surfaces of the device substrate 2, a protection portion 4 configured to cover the driver portion 3 so as to form a hollowed space 8 around the driver portion 3, an adhesion layer 10 that is made of a resin and arranged above the protection portion 4, and a reinforcing plate 11 arranged on the adhesion layer 10, wherein the reinforcing plate 11 is a silicon substrate.Type: GrantFiled: August 1, 2014Date of Patent: July 18, 2017Assignee: MURATA MANUFACTURING CO., LTDInventor: Masaaki Kanae
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Publication number: 20170133995Abstract: A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.Type: ApplicationFiled: January 20, 2017Publication date: May 11, 2017Inventor: Masaaki KANAE
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Patent number: 9590586Abstract: A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.Type: GrantFiled: September 16, 2013Date of Patent: March 7, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Masaaki Kanae
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Publication number: 20140339956Abstract: Provide an electronic component that has a hollowed structure and is capable of suppressing the deformation of the hollowed structure due to the pressure during the module resin molding. The electronic component includes a device substrate 2, a driver portion 3 formed on one of the principle surfaces of the device substrate 2, a protection portion 4 configured to cover the driver portion 3 so as to form a hollowed space 8 around the driver portion 3, an adhesion layer 10 that is made of a resin and arranged above the protection portion 4, and a reinforcing plate 11 arranged on the adhesion layer 10, wherein the reinforcing plate 11 is a silicon substrate.Type: ApplicationFiled: August 1, 2014Publication date: November 20, 2014Inventor: Masaaki Kanae
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Patent number: 8687378Abstract: A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided.Type: GrantFiled: August 22, 2013Date of Patent: April 1, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuyoshi Okuda, Masaaki Kanae, Naoki Hayasaka
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Publication number: 20140015373Abstract: A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.Type: ApplicationFiled: September 16, 2013Publication date: January 16, 2014Applicant: MURATA MANUFACTURING CO., LTD.Inventor: Masaaki KANAE
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Publication number: 20130335938Abstract: A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided.Type: ApplicationFiled: August 22, 2013Publication date: December 19, 2013Applicant: Murata Manufacturing Co., Ltd.Inventors: Nobuyoshi OKUDA, Masaaki KANAE, Naoki HAYASAKA
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Patent number: 6621149Abstract: A semiconductor chip production method in which, when a semiconductor chip is formed by severing from a semiconductor wafer, a short side of a semiconductor device is arranged and disposed along a direction which is parallel to a crystal orientation direction, and a severing area along the short side of the semiconductor device is formed so that its width is smaller than the width of a severing area along a long side of the semiconductor device. Further, the widths of the severing areas along the long and short sides of the semiconductor devices are formed so that after severing, the ratio between the long sides and the short sides of the semiconductor chips is smaller than the ratio between the long sides and the short sides of the unseparated semiconductor devices. The invention aims at preventing a reduction in the mechanical strength of a rectangular semiconductor chip having vertical and horizontal dimensions that are different from each other, when producing the rectangular semiconductor chip.Type: GrantFiled: February 8, 2002Date of Patent: September 16, 2003Assignee: Murata Manufacturing Co., Ltd.Inventor: Masaaki Kanae
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Patent number: 6501182Abstract: A semiconductor device includes an element formed on a first surface of a semiconductor substrate, a via-hole passing through the semiconductor substrate from the first surface to a second surface of the semiconductor substrate, and an electrode formed on the inner wall of the via-hole, the electrode passing through the semiconductor substrate from the first surface to the second surface. The electrode in the via-hole is electrically connected to at least one electrode of the element; the semiconductor substrate is mounted on a surface mount board; and the electrode formed on the inner wall of the via-hole is electrically connected to an electrode of the surface mount board by a conductive bonding material, such as a conductive adhesive. A method for fabricating the semiconductor device is also disclosed.Type: GrantFiled: June 25, 2001Date of Patent: December 31, 2002Assignee: Murata Manufacturing Co., Ltd.Inventors: Atsushi Kobayashi, Masaaki Sueyoshi, Masaaki Kanae, Makoto Inai
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Publication number: 20020115232Abstract: A semiconductor chip production method in which, when a semiconductor chip is formed by severing from a semiconductor wafer, a short side of a semiconductor device is arranged and disposed along a direction which is parallel to a crystal orientation direction, and a severing area along the short side of the semiconductor device is formed so that its width is smaller than the width of a severing area along a long side of the semiconductor device. Further, the widths of the severing areas along the long and short sides of the semiconductor devices are formed so that after severing, the ratio between the long sides and the short sides of the semiconductor chips is smaller than the ratio between the long sides and the short sides of the unseparated semiconductor devices. The invention aims at preventing a reduction in the mechanical strength of a rectangular semiconductor chip having vertical and horizontal dimensions that are different from each other, when producing the rectangular semiconductor chip.Type: ApplicationFiled: February 8, 2002Publication date: August 22, 2002Applicant: Murata Manufacturing Co., Ltd.Inventor: Masaaki Kanae
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Publication number: 20020050650Abstract: A semiconductor device includes an element formed on a first surface of a semiconductor substrate, a via-hole passing through the semiconductor substrate from the first surface to a second surface of the semiconductor substrate, and an electrode formed on the inner wall of the via-hole, the electrode passing through the semiconductor substrate from the first surface to the second surface. The electrode in the via-hole is electrically connected to at least one electrode of the element; the semiconductor substrate is mounted on a surface mount board; and the electrode formed on the inner wall of the via-hole is electrically connected to an electrode of the surface mount board by a conductive bonding material, such as a conductive adhesive. A method for fabricating the semiconductor device is also disclosed.Type: ApplicationFiled: June 25, 2001Publication date: May 2, 2002Applicant: Murata Manufacturing Co., Ltd.Inventors: Atsushi Kobayashi, Masaaki Sueyoshi, Masaaki Kanae, Makoto Inai
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Patent number: 5432494Abstract: A magnetoresistance element includes an insulating substrate, a patterned magnetoresistance film of a ferromagnetic material deposited thereon and having a uniaxis magnetic anisotropy, and a patterned hard biasing layer of a ferromagnetic material deposited on the substrate. The biasing layer is divided into two parts on both sides of the magnetoresistance layer and magnetized in the direction parallel to a line which intersects the easy direction of magnetization of the patterned magnetoresistance layer at an acute angle (.theta.).Type: GrantFiled: May 26, 1993Date of Patent: July 11, 1995Assignee: Murata Manufacturing Co., Ltd.Inventors: Keizou Inoue, Masaaki Kanae, Yoshifumi Ogiso, Takuji Nakagawa