Abstract: A semiconductor device includes: a semiconductor (10 ?m?tsi?30 ?m); a metal layer (30 ?m?tag?60 ?m) comprising Ag; a metal layer (10 ?m?tni?35 ?m) comprising Ni; and transistors. The transistors include a source electrode and a gate electrode on the semiconductor layer. The metal layer functions as a common drain region for the transistors. The ratio of the lengths of the longer side and the shorter side of the semiconductor layer is at most 1.73. The ratio of the surface area and the perimeter length of each electrode included in the source electrode is at most 0.127. The cumulative surface area of the source electrode and the gate electrode is at most 2.61 mm2. The length of the shorter side of the source electrode is at most 0.3 mm, and 702<2.33×tsi+10.5×tag+8.90×tni<943 is satisfied.

Abstract: A flow passage device includes a circulation flow passage, a swing valve provided in the circulation flow passage, an energizing part, and a lock mechanism including a lock pin. The lock pin is configured so as to hinder the swing valve from opening, and to allow the swing valve to open. The swing valve is configured so as to rotate from a first valve position to a second valve position. The lock mechanism is configured so as to set a locked state and to set an unlocked state. The lock pin is configured so as to protrude as being energized by pressure of the fluid on an upstream side of the swing valve, and to retract as being energized by pressure of the fluid on a downstream side of the swing valve.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to a method for manufacturing a semiconductor device of the present invention, the above-described problems can be solved by providing a layout of a TEG electrode pad corresponding to a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of an electrode pad of a TEG to facilitate the evaluation of electrical characteristics. According to the present invention, the above described problem can be solved by arranging a plurality of probes in a fan shape or manufacturing the probes with micro electro mechanical systems (MEMS) technology.

Abstract: According to one embodiment, an automatic analyzing apparatus includes a reagent depository, a reagent storage unit and a probe. The reagent depository stores a first reagent vessel. The reagent storage unit is provided separately from the reagent depository and in which a second reagent vessel is placeable. The probe suctions a reagent contained in the first reagent vessel at a first position which is located above the reagent depository, suctions a reagent contained in the second reagent vessel at a second position which is located above the reagent storage unit, and discharges the reagent suctioned from the first reagent vessel or the second reagent vessel into a reaction vessel at a third position.

Abstract: To provide a motor control method ensuring that dragging loss at the time of high rotation can be reduced. A motor control method, wherein a composite permanent magnet has a core part and a shell part, the Curie temperature of one of the core part and the shell part is Tc1 K, and the Curie temperature of another is Tc2 K, and wherein when the magnitude of the reluctance torque is equal to or greater than the magnitude of the magnet torque, the temperature of the composite permanent magnet is set at Ts K that is (Tc1?100) K or higher and lower than Tc2 K and when the magnitude of the reluctance torque is less than the magnitude of the magnetic torque, the temperature of the composite permanent magnet is set at lower than the temperature Ts K or Tc1 K, whichever is lower.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to an evaluation apparatus for a semiconductor device of the present invention, the above described problems can be solved by providing a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.

Abstract: The lighting control device includes a controller, a diagnosis circuit, a latch circuit, and a logic circuit. The controller outputs a control signal. The diagnosis circuit outputs an irregular signal. The latch circuit decides a state of a forcibly lighting signal. The logic circuit controls a light source in accordance with an ignition signal, the control signal, and the forcibly lighting signal. The logic circuit turns on the light source in accordance with the ignition signal while receiving the forcibly lighting signal, and turns on the light source in accordance with the control signal while not receiving the forcibly lighting signal.

Abstract: An object is to provide a paper barrier material having excellent gas barrier property as well as excellent water vapor barrier property, wherein such paper barrier material is suitable for packaging applications such as food packaging materials, containers, and cups. The means for achieving the object is to provide a paper barrier material characterized in that it meets the conditions in (1) to (3) below: (1) the water vapor permeability at 40±0.5° C. in temperature and 90±2% in relative humidity is 3 g/m2·day or below; (2) the oxygen permeability at 23° C. in temperature and 0% in relative humidity is 3 ml/m2·day·atm or below; and (3) the oxygen permeability at 23° C. in temperature and 85% in relative humidity is 3 ml/m2·day·atm or below.

Abstract: A semiconductor device includes: a semiconductor (10 ?m?tsi?30 ?m); a metal layer (30 ?m?tag?60 ?m) comprising Ag; a metal layer (10 ?m?tni?35 ?m) comprising Ni; and transistors. The transistors include a source electrode and a gate electrode on the semiconductor layer. The metal layer functions as a common drain region for the transistors. The ratio of the lengths of the longer side and the shorter side of the semiconductor layer is at most 1.73. The ratio of the surface area and the perimeter length of each electrode included in the source electrode is at most 0.127. The cumulative surface area of the source electrode and the gate electrode is at most 2.61 mm2. The length of the shorter side of the source electrode is at most 0.3 mm, and 702<2.33×tsi+10.5×tag+8.90×tni<943 is satisfied.

Abstract: A structure for a lower portion of a vehicle body includes a right side sill (14), a right floor frame (17), a right cross member (68), and a muffler. A fuel tank is provided on an inner side of the right floor frame (17) in a vehicle width direction. The right cross member (68) spans between the right floor frame (17) and the right side sill (14) and extends in the vehicle width direction. Furthermore, the muffler is provided in a region enclosed by the right side sill (14), the right floor frame (17), and the right cross member (68). The right cross member (68) has an upward deformation guiding part (77). The upward deformation guiding part (77) is formed to be able to be deformed upward due to an impact load (F2) input to the right side sill (14).

Abstract: A heat exchanger includes a liquid reservoir configured to separate a gas-liquid two-phase refrigerant flowing out of an upstream heat exchanging portion into a gas-phase refrigerant and a liquid-phase refrigerant, and a refrigerant adjustment portion configured to adjust an outflow state and an outflow destination of the refrigerant flowing out of a downstream heat exchanging portion or the liquid reservoir. The liquid reservoir includes a liquid reserving portion configured to store the liquid-phase refrigerant and a gas reserving portion configured to store the gas-phase refrigerant. The refrigerant adjustment portion faces the liquid reserving portion across the gas reserving portion.

Abstract: A production method of an input/output device is provided, including a cable connecting step of connecting a cable to be connected to a field device disposed outside a casing main body to a terminal block in a state where the terminal block is housed in the casing main body having an opening portion, an electronic device attaching step of attaching an electronic device to the casing main body by housing the electronic device having a connector portion, which the terminal block can be attached to and detached from, in the casing main body through the opening portion, a terminal block attaching step of attaching the terminal block to the connector portion, and a closing step of closing the opening portion of the casing main body by an opening/closing member.

Abstract: A partition plate is configured to separate an intake passage formed by an intake pipe to be coupled to a combustion chamber into a first intake passage and a second intake passage. The first intake passage is openable and closable by a valve. A shape of a first cross section orthogonal to an extending direction of the intake pipe is set on the basis of a shape of a surface of the intake pipe that faces the partition plate with the second intake passage interposed therebetween.