Abstract: An object of the present invention is to provide a fabrication method for pattern-formed structure having a smooth three-dimensional structure through a fewer processes. To achieve the object, the present invention provides a fabrication method for pattern-formed structure comprising: a dot modulation pattern forming process of binarizing a shape of a targeted three-dimensional structure to form a dot modulation pattern, a writing process of using the dot modulation pattern to write directly by a writer on a photosensitive resin layer formed on a substrate, and a developing process of developing the photosensitive resin layer after the writing to form a resin layer with three-dimensional structure, wherein the writing process is performed by a writing energy supplying method in which writing energy is supplied to the photosensitive resin layer by an area larger than a minimum dot area in the dot modulation pattern.

Abstract: An object of the present invention is to provide a fabrication method for pattern-formed structure having a smooth three-dimensional structure through a fewer processes. To achieve the object, the present invention provides a fabrication method for pattern-formed structure comprising: a dot modulation pattern forming process of binarizing a shape of a targeted three-dimensional structure to form a dot modulation pattern, a writing process of using the dot modulation pattern to write directly by a writer on a photosensitive resin layer formed on a substrate, and a developing process of developing the photosensitive resin layer after the writing to form a resin layer with three-dimensional structure, wherein the writing process is performed by a writing energy supplying method in which writing energy is supplied to the photosensitive resin layer by an area larger than a minimum dot area in the dot modulation pattern.

Abstract: An object of the present invention is to provide a fabrication method for pattern-formed structure having a smooth three-dimensional structure through a fewer processes. To achieve the object, the present invention provides a fabrication method for pattern-formed structure comprising: a dot modulation pattern forming process of binarizing a shape of a targeted three-dimensional structure to form a dot modulation pattern, a writing process of using the dot modulation pattern to write directly by a writer on a photosensitive resin layer formed on a substrate, and a developing process of developing the photosensitive resin layer after the writing to form a resin layer with three-dimensional structure, wherein the writing process is performed by a writing energy supplying method in which writing energy is supplied to the photosensitive resin layer by an area larger than a minimum dot area in the dot modulation pattern.

Abstract: A main object of the present invention is to provide a solid-state image sensor capable of efficiently collecting a light beam when the central position of the light receiving element and the central position of the micro lens do not coincide with each other in the plan view owing to a plural pixel sharing structure.

Abstract: The present invention provides an optical device that is miniature, is highly sensitive and has a simplified package, and a manufacturing method thereof with high production efficiency and high reliability. The present invention is an optical device comprising: a photoelectric conversion element (50) having at least one photoelectric conversion portion (1) which is formed on a substrate (10); a sealing material (14); and a connection terminal (3). The optical device comprises an optical window which is an interface between the photoelectric conversion element (50) and an outside of the optical device; and an aperture (6) formed in the sealing material 14, and whose bottom face is the optical window. An entire face of the optical window is exposed to the outside. An optical adjustment element (13) may be formed on the interface. In this case, the interface between the optical adjustment element (13) and the outside is the optical window.

Abstract: A photoelectric conversion element having a composite dye and an n-type semiconductor, the composite dye having a plurality of component dyes which have different excitation levels and which are chemically bonded to each other to form a straight chain or branched structure for transferring an electron therethrough, wherein the straight chain or branched structure is, at one end thereof, secured to the n-type semiconductor and has, at least at one other end thereof, a free end, wherein, in the straight chain or branched structure, the plurality of component dyes are arranged in an order such that the excitation levels of the plurality of component dyes are decreased as viewed from the one end of the structure toward the at least one other end of the structure.

Abstract: It is an object of the present invention to effectively manufacture a charged-particle beam lithography mask, an X-ray lithography mask, or an extreme ultraviolet beam lithography mask by using, for example, an existing writer such as an electron beam writer for photomasks, while achieving improvement in processing accuracy of a mask pattern. A lithography mask (1) comprises a substrate (2) which has a lower surface provided substantially at the center thereof with an opening (3) and a self-supporting membrane (m) having a pattern region (4) substantially at the center of an upper surface of the substrate (2) corresponding to the opening (3). The self-supporting membrane (m) is provided with through-holes (h) of a mask pattern in it or an absorber or scatterer of a mask pattern on it, and the pattern region (4) and a peripheral region around the pattern region (5) are in one plane.

Abstract: A main object of the present invention is to provide a method for manufacturing a microlens that can easily form a microlens having a smooth shape, in which a maximum thickness position is different from a gravity center position. To attain the object, the present invention provides a method for manufacturing a microlens comprising processes of: a basic shape forming-exposure process for performing exposure by using a microlens basic shape-forming mask to a photosensitive resin layer formed on a substrate; and a deforming-exposure process for performing exposure, with a unit cell-exposure profile different from that of the exposure performed in the basic shape forming-exposure process, to the photosensitive resin layer by using a microlens-shape-adjusting mask, wherein a microlens, having a maximum thickness position different from a gravity center position is formed.

Abstract: The present invention provides an optical device that is miniature, is highly sensitive and has a simplified package, and a manufacturing method thereof with high production efficiency and high reliability. The present invention is an optical device comprising: a photoelectric conversion element (50) having at least one photoelectric conversion portion (1) which is formed on a substrate (10); a sealing material (14); and a connection terminal (3). The optical device comprises an optical window which is an interface between the photoelectric conversion element (50) and an outside of the optical device; and an aperture (6) formed in the sealing material 14, and whose bottom face is the optical window. An entire face of the optical window is exposed to the outside. An optical adjustment element (13) may be formed on the interface. In this case, the interface between the optical adjustment element (13) and the outside is the optical window.

Abstract: A main object of the present invention is to provide a method for manufacturing a microlens that can easily form a microlens having a smooth shape, in which a maximum thickness position is different from a gravity center position. To attain the object, the present invention provides a method for manufacturing a microlens comprising processes of: a basic shape forming-exposure process for performing exposure by using a microlens basic shape-forming mask to a photosensitive resin layer formed on a substrate; and a deforming-exposure process for performing exposure, with a unit cell-exposure profile different from that of the exposure performed in the basic shape forming-exposure process, to the photosensitive resin layer by using a microlens-shape-adjusting mask, wherein a microlens, having a maximum thickness position different from a gravity center position is formed.

Abstract: An object of the present invention is to provide a fabrication method for pattern-formed structure having a smooth three-dimensional structure through a fewer processes. To achieve the object, the present invention provides a fabrication method for pattern-formed structure comprising: a dot modulation pattern forming process of binarizing a shape of a targeted three-dimensional structure to form a dot modulation pattern, a writing process of using the dot modulation pattern to write directly by a writer on a photosensitive resin layer formed on a substrate, and a developing process of developing the photosensitive resin layer after the writing to form a resin layer with three-dimensional structure, wherein the writing process is performed by a writing energy supplying method in which writing energy is supplied to the photosensitive resin layer by an area larger than a minimum dot area in the dot modulation pattern.

Abstract: Disclosed are an organic domain/inorganic domain hybrid material comprising an organic domain comprising at least one water-soluble organic polymer having anionic and/or cationic functional groups, and an inorganic domain, the organic and inorganic domains being chemically bonded to each other through the functional groups, the inorganic domain comprising inorganic bridges, each independently comprising at least one Si atom, at least two O atoms and at least one divalent metal atom, wherein the Si atom and the O atoms together form at least one siloxane linkage arranged longitudinally of the inorganic bridge, wherein each divalent metal atom is ionically bonded to the O atoms of the siloxane linkages positioned adjacent to the divalent metal atoms, wherein, when at least a part of the organic domain is comprised of at least one organic polymer having an anionic functional group and optionally a cationic functional group, the organic domain/inorganic domain weight ratio is less than 1.

Abstract: The present invention relates to a method for culturing cells, which comprises the steps of: causing cells to adhere to the surface of a cell array substrate having a cell adhesiveness variation pattern that comprises regions having good cell adhesiveness and regions having inhibited cell adhesiveness patterned on a substrate; transferring the adhered cells to a cell culture substrate in such patterned state; and culturing the transferred cells.

Abstract: A main object of the present invention is to provide a solid-state image sensor capable of efficiently collecting a light beam when the central position of the light receiving element and the central position of the micro lens do not coincide with each other in the plan view owing to a plural pixel sharing structure.

Abstract: The invention relates to a process for the fabrication of an optical fiber-processing phase mask that is reduced in terms of pitch variations on the mask and stitching errors, and provides a process for the fabrication of a chirped type optical fiber-processing phase mask wherein a grating form of grooves provided in one surface of a quartz substrate is configured as an optical fiber-processing grating pattern. At an exposure step, writing data obtained by arranging and compiling a plurality of data for a repetitive groove-and-strip pattern while the pitch of repetition is modulated are used and an electron beam resist is provided on a phase mask blank, so that writing is carried out all over the writing area on said phase mask blank continuously in a vertical direction to said grating form of grooves.

Abstract: A photoelectric conversion element having a composite dye and an n-type semiconductor, the composite dye having a plurality of component dyes which have different excitation levels and which are chemically bonded to each other to form a straight chain or branched structure for transferring an electron therethrough, wherein the straight chain or branched structure is, at one end thereof, secured to the n-type semiconductor and has, at least at one other end thereof, a free end, wherein, in the straight chain or branched structure, the plurality of component dyes are arranged in an order such that the excitation levels of the plurality of component dyes are decreased as viewed from the one end of the structure toward the at least one other end of the structure.

Abstract: The present invention provides a substrate-engraving-type chromeless phase-shift mask enabling to adopt a manufacturing method which poses no problem in quality, gives a high operating efficiency, and permits arrangement of characters and symbols, and a manufacturing method thereof. The substrate of the invention has a character/symbol section, on a surface of a transparent substrate, comprising characters and/or symbols engraved in the form of a slit-shaped or lattice-shaped pattern comprising concave grooves only in a prescribed portion corresponding to the characters and/or symbols.

Abstract: It is an object of the present invention to effectively manufacture a charged-particle beam lithography mask, an X-ray lithography mask, or an extreme ultraviolet beam lithography mask by using, for example, an existing writer such as an electron beam writer for photomasks, while achieving improvement in processing accuracy of a mask pattern. A lithography mask (1) comprises a substrate (2) which has a lower surface provided substantially at the center thereof with an opening (3) and a self-supporting membrane (m) having a pattern region (4) substantially at the center of an upper surface of the substrate (2) corresponding to the opening (3). The self-supporting membrane (m) is provided with through-holes (h) of a mask pattern in it or an absorber or scatterer of a mask pattern on it, and the pattern region (4) and a peripheral region around the pattern region (5) are in one plane.

Abstract: The present invention relates to a precision phase mask for forming diffraction grating in optical fiber and optical waveguide, to provide them with nonlinear chirped grating for dispersion compensation use and having low fluctuation or crosstalk in the group delay characteristics. The diffraction grating is formed by means of interference fringe between diffracted lights of different orders, in which the cycle of the diffraction grating 20 increases nonlinearly, wherein plurality of diffraction gratings G1, G2, G3 . . . having different cycles are assembled on a plane in increasing order of the cycle with the directions of the diffraction gratings directed to the same direction, and assembled in such a manner that, where the cycle of grating changes nonlinearly and discontinuously, the regions having larger rate of change of the cycle contain proportionally more discontinuous phases per unit length.

Abstract: A patterning method for micro-contact printing involves the steps of: applying a resin on a master having projected patterns, hardening the resin and thereafter removing the hardened resin from the master to make a stamp of the resin; applying a molecular ink including hydrophobic molecules dispersed in a solvent on the stamp; forming micro-contact printed patterns of the hydrophobic molecular layer on a substrate by means of the stamp on which the molecular ink is applied; dipping the substrate with micro-contact printed patterns in a hydrophilic molecule solution dispersed in a solvent to give chemical modification to the areas of the surface of the substrate around the micro-contact printed patterns, the solution including hydrophilic molecules having a chain length shorter than the chain length of hydrophobic molecules included in the molecular ink is used as the hydrophilic molecule solution.