Patents by Inventor Masaaki Miyazawa

Masaaki Miyazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6428338
    Abstract: A connector of the invention includes a main body; a terminal, arranged at the main body, to be electrically connected with a connection object having at least one uneven part; and an auxiliary member mounted on the main body and having at least one fitting part to fit to the respective of the at least one uneven part of the connection object. According to the invention, when the uneven part varies in location and/or configuration in accordance with the types of the connection objects used, only the connection object having the uneven part corresponding in location and/or configuration to the fitting part formed in the auxiliary member can be loaded onto the connector to prevent erroneous loading of the connection object.
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: August 6, 2002
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Kaori Yasufuku, Taiji Hosaka, Masaaki Miyazawa
  • Patent number: 6403300
    Abstract: The present invention relates to Friend murine leukemia virus (F-MuLV) specific monoclonal antibodies, or binding fragments thereof, specific for an antigenic determinant of a gp85 envelope precursor protein characteristic of a methanol-fixed F-MuLV infected cell. The invention also relates to hybridomas resulting from the fusion of myeloma cells and spleen cells, which hybridomas produce a Friend murine leukemia virus (F-MuLV) specific monoclonal antibody specific for an antigenic determinant of a gp85 envelope precursor protein characteristic of a methanol-fixed F-MuLV infected cell. The invention further relates to kits containing the above-described monoclonal antibodies.
    Type: Grant
    Filed: May 2, 1991
    Date of Patent: June 11, 2002
    Assignee: The United States of America as represented by the Department of Health and Human Services
    Inventors: Michael N. Robertson, Bruce Chesebro, Masaaki Miyazawa, William J. Britt
  • Patent number: 6370025
    Abstract: An electronic module of the invention is so structured that a plurality of first electronic components are mounted on a top surface of a card-like substrate; a first radiating board is commonly stuck to two or more top surfaces of the first electronic components; a plurality of second electronic components are mounted on a bottom surface of the substrate; and a second radiating board is commonly stuck to two or more bottom surfaces of the second electronic components. The heat generated by high-speed operation of the first and second electronic components is radiated to outside air through the first and second radiating boards.
    Type: Grant
    Filed: October 18, 2000
    Date of Patent: April 9, 2002
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Kaori Yasufuku, Taiji Hosaka, Masaaki Miyazawa
  • Publication number: 20020031948
    Abstract: A connector for module that connects a module to a printed circuit board in a position wherein the board plane of the module is approximately parallel to the printed circuit board.
    Type: Application
    Filed: August 23, 2000
    Publication date: March 14, 2002
    Inventors: Kaori Yasufuku, Taiji Hosaka, Masaaki Miyazawa
  • Publication number: 20010036756
    Abstract: A connector module to be connected to an integrated circuit device having rear electrodes provided on a back surface thereof facing away from a wiring board. The connector module includes: a connector having contacts to be electrically connected to the rear electrodes; and a fixture structure for fixing the connector to the integrated circuit device.
    Type: Application
    Filed: April 18, 2001
    Publication date: November 1, 2001
    Applicant: J. S. T. Mfg. Co., Ltd.
    Inventors: Masaaki Miyazawa, Taiji Hosaka
  • Patent number: 6278610
    Abstract: A connector for module that connects a module to a printed circuit board in a position wherein the board plane of the module is approximately parallel to the printed circuit board.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: August 21, 2001
    Assignee: J.S.T. Mfg. Co., Ltd.
    Inventors: Kaori Yasufuku, Tai ji Hosaka, Masaaki Miyazawa
  • Publication number: 20010014546
    Abstract: A cap that is to be fitted to a printed circuit board, which has a conductive pad on the front side of the rectangular board thereof and which is to be connected to the connector. The cap is formed into a bag and is shaped into a wedge that gets thinner towards the front, and the cap has a window for exposing the conductive pad of the printed circuit board.
    Type: Application
    Filed: March 16, 2001
    Publication date: August 16, 2001
    Inventors: Kaori Yasufuku, Taiji Hosaka, Masaaki Miyazawa
  • Patent number: 5687269
    Abstract: A method of oblique spherical polishing of an optical connector by which a desired contact surface angle on an axis of the optical connector is obtained easily and securely without requiring additional processing. In order to form a dome of a radius R, which is oblique with the contact surface angle .theta.', at the end surface of the optical connector 20, which has ferrule 22 of which a tip 24 is beveled, the tip of the optical connector 20 is polished by tilting it with the angle .theta. which fulfills the relationsin .theta.=sin .theta.'+S/Rwhere S is the amount of the deviation of the dome.
    Type: Grant
    Filed: August 23, 1996
    Date of Patent: November 11, 1997
    Assignee: The Whitaker Corporation
    Inventors: Okitsugu Furuya, Akihiro Miyachi, Masaaki Miyazawa