Patents by Inventor Masaaki Morimitsu

Masaaki Morimitsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Laminated structure for electronic equipment and method of electroless gold plating
    Publication number: 20020094449
    Abstract: A laminated structure for electronic equipment includes a printed circuit board having copper foil, an undercoat plating layer made of tin or silver, formed on the printed circuit board, and a gold plating layer formed on the undercoat plating layer by electroless plating. Tin or silver is a metal which acts as an anticatalyst in electroless plating. After formation of the undercoat plating layer, the printed circuit board is dipped in catalyst-applying treating liquid to inhibit the anticatalyst.
    Type: Application
    Filed: November 23, 2001
    Publication date: July 18, 2002
    Inventors: Isamu Takeuchi, Masaaki Morimitsu