Patents by Inventor Masaaki Nanba

Masaaki Nanba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6493189
    Abstract: A head gimbal assembly is provided with a slider that flies above the surface of a disk, and a head for reading/writing data from/onto the surface of the disk. One or more conductive wires are connected to the head and are used to transmit data. A load beam supports the wire(s) thereon and holds the head/slider near a front end of the load beam. Each wire forms a wire loop between the head connecting point edge and the wire fixing point. A predetermined portion of each wire loop is pressed from above on the surface of the load beam, and then pushed toward the head connecting point edge, thereby plastically deforming a section between the head connecting point edge and the predetermined portion of the wire loop.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: December 10, 2002
    Assignee: International Business Machines Corporation
    Inventors: Kenji Itoh, Yasuhiro Mita, Masaaki Nanba, Tatsushi Yoshida
  • Patent number: 6459549
    Abstract: Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.
    Type: Grant
    Filed: June 5, 2000
    Date of Patent: October 1, 2002
    Assignee: International Business Machines Corporation
    Inventors: Tatsumi Tsuchiya, Tatsushi Yoshida, Hiroyasu Tsuchida, Hiroo Inoue, Surya Pattanaik, Hiromi Ishikawa, Masaaki Nanba