Abstract: A high-temperature bimetal capable of being inhibited from considerably shifting from an original position when the temperature has fallen to an ordinary temperature is provided. This high-temperature bimetal (1) includes a high thermal expansion layer (2) made of austenitic stainless steel and a low thermal expansion layer (3) made of a thermosensitive magnetic metal having a Curie point and bonded to the high thermal expansion layer. The high-temperature bimetal is employed over both a high temperature range of not less than the Curie point and a low temperature range of less than the Curie point, while an upper limit of operating temperatures in the high temperature range of not less than the Curie point is at least 500° C.

Abstract: Metal nanoink for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent in the form of oxygen nanobubbles or oxygen bubbles either before or after metal nanoparticles whose surfaces are coated with a dispersant are mixed into the organic solvent. Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

Abstract: Metal nanoink (100) for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent (105) in the form of oxygen nanobubbles (125) or oxygen bubbles (121) either before or after metal nanoparticles (101) whose surfaces are coated with a dispersant (102) are mixed into the organic solvent (105). Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink (100) onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

Abstract: A sensor-fitted substrate allowing a sensor-fitted wafer for measuring the temperature or strain to be produced inexpensively, moreover, allowing measurements of the temperature or strain to be carried out with satisfactory accuracy, and a method for producing such a sensor-fitted substrate. An undercoat film is formed on the surface of a substrate, the film being configured, compared to when no undercoat film is formed, to allow the strength of close contact of a dispersed nano-particle ink with the substrate to be increased, the diffusion of the dispersed nano-particle ink into the substrate to be suppressed, and the growth of metal crystal particles contained in the dispersed nano-particle ink to be suppressed. A wiring pattern of the sensor is traced on the surface of the undercoat film of the substrate surface by using the dispersed nano-particle ink, and the dispersed nano-particle ink is baked and metalized.

Abstract: Metal nanoink (100) for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent (105) in the form of oxygen nanobubbles (125) or oxygen bubbles (121) either before or after metal nanoparticles (101) whose surfaces are coated with a dispersant (102) are mixed into the organic solvent (105). Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink (100) onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

Abstract: A production method for an optical transmission element, wherein a cylindrical transparent resin is used as a core wire, a monomer becoming a polymer different in refractive index from the core wire after polymerized or a mixture of a monomer and a polymer is bonded to the outer periphery of the core wire and the monomer is diffused from the outer periphery of the core wire to thereby form the monomer inside the core wire at a proper concentration distribution, and then the monomer is further polymerized to the core wire to provide a distribution layer having different refractive indexes from the center toward the outer periphery, whereby it is possible to provide a graded index type optical transmission element at low costs with a simple facility.

Abstract: The present invention relates to ink jet printing ink consisting of an independently dispersed metal ultrafine particles-containing liquid dispersion in which the metal ultrafine particles having a particle size of not more than 100 nm are independently and uniformly dispersed and which is excellent in characteristic properties required for ink. The ink is used in the printing or the formation of conductive circuits using an ink jet printer.

Abstract: Each of the metal nano-particles present in a dispersion, which comprises at least one metal selected from the group consisting of precious metals and transition metals or an alloy of at least two metals selected from the foregoing metals, comprises a metal particle in which an organic metal compound of a fatty acid and/or an amine-metal complex is adhered to the periphery of the metal particle. This organic metal compound and the amine-metal complex are admixed together in a solvent and then the resulting mixture is subjected to a reducing treatment to thus form a dispersion containing metal nano-particles in a concentration of not less than 5% by mass and not more than 90% by mass. The resulting dispersion is applied onto the surface of a base material, followed by drying the applied layer of the dispersion and then firing the dried layer of the dispersion at a low temperature to thus form a thin metallic wire or a metal film having conductivity.

Abstract: A metal thin film-forming method which comprises the step of firing metal nanoparticles each comprising a particle consisting of at least one metal selected from Ag, Au, Ni, Pd, Rh, Ru, and Pt or an alloy comprising at least two of these metals and an organic substance adhered to the periphery thereof as a dispersant, under a gas atmosphere containing water and/or an organic acid to thus form a metal thin film. This metal thin film possesses a low resistance value.

Abstract: A production method for an optical transmission element (1), wherein a cylindrical transparent resin is used as a core wire, a monomer becoming a polymer different in refractive index from the core wire after polymerized or a mixture of a monomer and a polymer (2) is bonded to the outer periphery of the core wire and the monomer is diffused from the outer periphery of the core wire to thereby form the monomer inside the core wire at a proper concentration distribution, and then the monomer is further polymerized to the core wire to provide a distribution layer having different refractive indexes from the center toward the outer periphery, whereby it is possible to provide a graded index type optical transmission element at low costs with a simple facility.

Abstract: The present invention provides a method for forming an electrode of a flat panel display device using ink for ink jet printing and an ink jet printer. The ink for ink jet printing is prepared by a method comprising the first step of contacting the vapor of a metal with the vapor of the first solvent, according to the vapor phase-evaporation technique, to thus give a dispersion of metal ultrafine particles; the second step of adding a low molecular weight polar solvent as the second solvent to the dispersion prepared in the first step to thus precipitate the metal ultrafine particles and removing the first solvent; and the third step of adding the third solvent to the precipitates thus prepared to carry out the solvent substitution and to give a dispersion of independently dispersed metal ultrafine particles, and prepared by adding a dispersant in or during the foregoing first and/or third steps, and the ink for ink jet printing consists of a dispersion excellent in ink characteristic properties.

Abstract: Each of the metal nano-particles present in a dispersion, which comprises at least one metal selected from the group consisting of precious metals and transition metals or an alloy of at least two metals selected from the foregoing metals, comprises a metal particle in which an organic metal compound of a fatty acid and/or an amine-metal complex is adhered to the periphery of the metal particle. This organic metal compound and the amine-metal complex are admixed together in a solvent and then the resulting mixture is subjected to a reducing treatment to thus form a dispersion containing metal nano-particles in a concentration of not less than 5% by mass and not more than 90% by mass. The resulting dispersion is applied onto the surface of a base material, followed by drying the applied layer of the dispersion and then firing the dried layer of the dispersion at a low temperature to thus form a thin metallic wire or a metal film having conductivity.

Abstract: To the surface of a base material, there is applied, a dispersion containing fine particles of at least one metal selected from the group consisting of indium, tin, antimony, aluminum and zinc, fine particles of at least one alloy consisting of at least two metals specified above or a mixture of these fine particles, the coated layer is then fired in a vacuum atmosphere, an inert gas atmosphere, a reducing atmosphere; and subsequently the layer is fired in an oxidizing atmosphere. After this firing step in an oxidizing atmosphere, the coated layer may further be fired in a reducing atmosphere. The inert gas atmosphere is one comprising at least one inert gas selected from the group consisting of rare gases, carbon dioxide and nitrogen and the reducing atmosphere is one comprising at least one reducing gas selected from the group consisting of hydrogen, carbon monoxide and lower alcohols. A transparent electrode is composed of a transparent conductive film prepared according to the foregoing method.

Abstract: This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.

Abstract: To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily and simply formed. A nano-meter order particle (100), a dispersant (110) for preventing aggregation of the particles (100), and a scavenger (120) for trapping the dispersant (110) at the sintering are mixed in a solvent (130) to prepare a paste body (140), and this paste body (140) is coated on a base material and fired, thereby forming a sensing film.

Abstract: The present invention provides a method for forming an electrode of a flat panel display device using ink for ink jet printing and an ink jet printer. The ink for ink jet printing is prepared by a method comprising the first step of contacting the vapor of a metal with the vapor of the first solvent, according to the vapor phase-evaporation technique, to thus give a dispersion of metal ultrafine particles; the second step of adding a low molecular weight polar solvent as the second solvent to the dispersion prepared in the first step to thus precipitate the metal ultrafine particles and removing the first solvent; and the third step of adding the third solvent to the precipitates thus prepared to carry out the solvent substitution and to give a dispersion of independently dispersed metal ultrafine particles, and prepared by adding a dispersant in or during the foregoing first and/or third steps, and the ink for ink jet printing consists of a dispersion excellent in ink characteristic properties.

Abstract: This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of the invention uses, as conductive media, in combination with metal fillers having an average particle diameter of 0.

Abstract: A first liquid including a first metal particle is disposed on the base board (11) via a liquid ejecting section (10) so as to form a conductive layer wiring having a predetermined pattern on a base board (11). A surface of the base board (11) is treated so as to be liquid-repellent. A second liquid which is different from a first liquid is disposed on the base board (11) by a liquid ejecting section (10) in advance. Thus, an interlayer W1 which can improve an adhesion between the base board (11) and the conductive layer wiring is formed. By doing this, a method for forming a conductive layer wiring for realizing a finer width in the conductive layer wiring and enhancing an adhesion between the base board and the conductive layer wiring can be provided.

Abstract: To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily and simply formed. A nano-meter order particle (100), a dispersant (110) for preventing aggregation of the particles (100), and a scavenger (120) for trapping the dispersant (110) at the sintering are mixed in a solvent (130) to prepare a paste body (140), and this paste body (140) is coated on a base material and fired, thereby forming a sensing film.

Abstract: The present invention relates to a liquid dispersion of metal ultrafine particles, which can maintain a desired flow ability even at a high concentration, which is free of any aggregation between fine particles and which can be concentrated. This liquid dispersion is used in, for instance, multilayer distributing wires of, for instance, IC substrates and internal distributing wires of semiconductor devices. If using, as a dispersant, at least one member selected from the group consisting of alkylamines, which are primary amines and whose main chain contains 4 to 20 carbon atoms, carboxylic acid amides and amino-carboxylic acid salts, metal ultrafine particles having a particle size of not more than 100 nm are individually or separately dispersed in the resulting liquid dispersion.