Abstract: A test device by immunochromatography comprises a case including a dropping window for a specimen and a detection window, and a test piece in the case. The test piece includes first and second detection portions, and a dropping area common to the first and second detection portions. When the specimen is dropped on the dropping area through the dropping window, the specimen migrates downstream and the same specimen reaches the first and second detection portions. The first detection portion traps a complex of a first labeled body and a first antibody contained in the specimen. The second detection portion traps a complex of a second labeled body and a second antibody contained in the specimen. The first antibody is produced by vaccination or infection with a predetermined virus. The second antibody is produced by infection with the virus.

Abstract: An expanded housing (2) including an outer tubular portion (2a), a center-top tubular portion (2b), an annular ceiling portion (2c), and a center-bottom tubular portion (2d) is an integrally molded plastic product. Vertical plate rib-shaped portions (2h) for increasing strength are similarly integrally molded between the outer tubular portion (2a) and the center-top tubular portion (2b). An inner passage region (B) for upward passage of content is set in the center tubular portion (2b). A housing cover (28) provided in such a form as to surround the lower side of the expanded housing (2) forms an outer passage region (A) which is disposed between the housing cover (28) and an outer peripheral surface of the expanded housing (2) so as to extend downward from an upper-end-side inner space region of an inner bag-shaped container (1g) to the inner passage region (B).

Abstract: An expanded housing (2) including an outer tubular portion (2a), a center-top tubular portion (2b), an annular ceiling portion (2c), and a center-bottom tubular portion (2d) is an integrally molded plastic product. Vertical plate rib-shaped portions (2h) for increasing strength are similarly integrally molded between the outer tubular portion (2a) and the center-top tubular portion (2b). An inner passage region (B) for upward passage of content is set in the center tubular portion (2b). A housing cover (28) provided in such a form as to surround the lower side of the expanded housing (2) forms an outer passage region (A) which is disposed between the housing cover (28) and an outer peripheral surface of the expanded housing (2) so as to extend downward from an upper-end-side inner space region of an inner bag-shaped container (1g) to the inner passage region (B).

Abstract: The tip-stop mechanism for an aerosol container has a needle valve placed into a passage area and closes discharge hole due to plate springs engagement with tapered surfaces of the needle valve. An operation lever is supported on a pivot shaft and when pressed downward forces a portion of the lever to cause the needle valve to move backward, opening the discharge hole. After that, the operation lever engages the upper surface of the spout and moves downward together with the spout and the stem, thereby the lever is shifted to an operation mode.

Abstract: A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. Solder balls are arranged on the surface of the encapsulating resin and connected to the outer ends of the columnar electrodes. In another example, pin wires are formed by half-cutting bonding wires, bonding one end of each of the bonding wires, and cutting the bonding wires at the half-cut portions.

Abstract: A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.

Abstract: A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

Abstract: A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.

Abstract: A method of producing a semiconductor device includes a device body producing step, electrically coupling leads and a semiconductor chip, and producing a device body by encapsulating the semiconductor chip by a resin package so that portions of the leads are exposed from the resin package, a honing step, carrying out a honing process using a polishing solution at least with respect to a resin flash adhered on the portions of the leads exposed from the resin package, an etching step, removing an unwanted stacked layer structure formed on the leads by carrying out an etching process after the honing step, and a plating step, carrying out a plating process with respect to the leads after the etching step to form a plated layer made of a soft bonding material. The honing step removes a portion of the unwanted stacked layer structure in addition to the resin flash.

Abstract: A semiconductor device including a semiconductor chip, connection parts arranged along one end of the semiconductor chip, and external connection terminals connected to the connection parts.

Abstract: A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

Abstract: An adhesive composition including: a main component comprising a resin material, a solvent for dissolving said main component, and a filler added to said main component, wherein said filler has a particle size so as to make a concavo-convex depth of a surface of said adhesive composition equal to or less than 15 .mu.m after said adhesive composition is applied to an adherend and dried in order to evaporate said solvent before a thermocompression process. The present invention also discloses a semiconductor device using the adhesive composition, an adhering method using the adhesive composition and a method for producing a semiconductor device using the adhesive composition.

Abstract: A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.