Abstract: An object of this invention is to obtain a molded module with which improvements are achieved in the packaging ability and heat dissipation performance of an inverter module itself, and in the mounting capacity of a peripheral mounting component such as a substrate, which must be taken into consideration in relation to the shape of the module. Provided is a molded module for use in power electronics, having an inbuilt semiconductor element used to supply and control a large amount of power, the molded module including at least one semiconductor switching element provided in the module and a lead frame that dissipates heat from the switching element and electrically connects an element packaged in the module to an external circuit, wherein at least one end of the module is molded in a curved shape or a polygonal shape.

Abstract: A connector structure that is joined to a housing so as to form the control unit includes a connector main body in which a connector is formed, a terminal including a power supply system and a signal system, and a component mounting portion including at least one of a capacitor and a coil, wherein the component mounting portion is provided parallel to a motor output shaft on the exterior of a motor or the housing, and the at least one of the capacitor and the coil included in the component mounting portion is electrically connected directly to the connector of the connector main body via the terminal.

Abstract: A frame has upper and lower surfaces that extend in a perpendicular direction to a motor output shaft, donut-shaped conductive plates are mounted respectively on the upper and lower surfaces, and the conductive plates both include connection-forming terminal portions provided on inner and outer peripheral sides thereof. An inverter circuit is constituted by a power module formed from a plurality of switching elements, a power supply terminal is provided on one side of a package forming the power module, while an output terminal connected to a winding terminal for supplying power to a motor and a control terminal connected to a control signal are provided on an opposing side. The terminal portions on the inner peripheral sides of the conductive plates are connected to the power supply terminal of the power module, and the control board is connected to the control terminal of the power module.

Abstract: A semiconductor module is provided in which a semiconductor element is mounted and a plurality of outside connecting modules are drawn from a side of a mold resin portion. To ensure sufficient space for a holding tool used in mounting the semiconductor module to a device with a simple structure, holding side portions are provided for at least two opposing corner portions of corner portions between adjacent sides of the mold resin portion.

Abstract: A frame has upper and lower surfaces that extend in a perpendicular direction to a motor output shaft, donut-shaped conductive plates are mounted respectively on the upper and lower surfaces, and the conductive plates both include connection-forming terminal portions provided on inner and outer peripheral sides thereof. An inverter circuit is constituted by a power module formed from a plurality of switching elements, a power supply terminal is provided on one side of a package forming the power module, while an output terminal connected to a winding terminal for supplying power to a motor and a control terminal connected to a control signal are provided on an opposing side. The terminal portions on the inner peripheral sides of the conductive plates are connected to the power supply terminal of the power module, and the control board is connected to the control terminal of the power module.

Abstract: A semiconductor module is provided in which a semiconductor element is mounted and a plurality of outside connecting modules are drawn from a side of a mold resin portion. To ensure sufficient space for a holding tool used in mounting the semiconductor module to a device with a simple structure, holding side portions are provided for at least two opposing corner portions of corner portions between adjacent sides of the mold resin portion.

Abstract: A connector structure that is joined to a housing so as to form the control unit includes a connector main body in which a connector is formed, a terminal including a power supply system and a signal system, and a component mounting portion including at least one of a capacitor and a coil, wherein the component mounting portion is provided parallel to a motor output shaft on the exterior of a motor or the housing, and the at least one of the capacitor and the coil included in the component mounting portion is electrically connected directly to the connector of the connector main body via the terminal.

Abstract: An object of this invention is to obtain a molded module with which improvements are achieved in the packaging ability and heat dissipation performance of an inverter module itself, and in the mounting capacity of a peripheral mounting component such as a substrate, which must be taken into consideration in relation to the shape of the module. Provided is a molded module for use in power electronics, having an inbuilt semiconductor element used to supply and control a large amount of power, the molded module including at least one semiconductor switching element provided in the module and a lead frame that dissipates heat from the switching element and electrically connects an element packaged in the module to an external circuit, wherein at least one end of the module is molded in a curved shape or a polygonal shape.

Abstract: A control device (28) includes: a housing (15); a control section including control-section connection terminals (5, 6, 7) and an electronic component (22); a heat sink (13); an external-connection connector (8) which includes connector connection terminals (9, 10, 11) to be electrically connected to the control-section connection terminals (5, 6, 7); and a cover (17). The connector connection terminals (9, 10, 11) and the control-section connection terminals (5, 6, 7) pass through a housing hole portion (16) covered with the cover (17) to be electrically connected to each other at respective distal end portions. Accordingly, in the control device having a different mounting direction of the external-connection connector or including a different type of the external-connection connector, the same housing, heat sink, and control section can be used so that manufacturing cost of the control device can be significantly reduced.

Abstract: A control device (28) includes: a housing (15); a control section including control-section connection terminals (5, 6, 7) and an electronic component (22); a heat sink (13); an external-connection connector (8) which includes connector connection terminals (9, 10, 11) to be electrically connected to the control-section connection terminals (5, 6, 7); and a cover (17). The connector connection terminals (9, 10, 11) and the control-section connection terminals (5, 6, 7) pass through a housing hole portion (16) covered with the cover (17) to be electrically connected to each other at respective distal end portions. Accordingly, in the control device having a different mounting direction of the external-connection connector or including a different type of the external-connection connector, the same housing, heat sink, and control section can be used so that manufacturing cost of the control device can be significantly reduced.

Abstract: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5).

Abstract: Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5).

Abstract: A filter attaching device comprises a receiving drum for forming a tip-paper piece, and a rolling plate which cooperates with the peripheral surface of the receiving drum to define a rolling passage. The rolling plate has a pair of receding portions 54 arranged on the left and right sides of the upper surface thereof. Due to the receding portions 54, contact resistance produced between the rolling surface and an intermediate product rolling on in the rolling passage, or more specifically, cigarettes included in the intermediate product is reduced.