Patents by Inventor Masaaki Tozawa

Masaaki Tozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sandwiched thermal solution
    Patent number: 7799428
    Abstract: A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
    Type: Grant
    Filed: October 6, 2004
    Date of Patent: September 21, 2010
    Assignee: GrafTech International Holdings Inc.
    Inventors: Kikuo Fujiwara, Masaaki Tozawa, Gary D. Shives, Julian Norley, Robert Anderson Reynolds, III
  • Conductive polymer and solid electrolytic capacitor using the same
    Patent number: 7651639
    Abstract: The conductive polymer of the present invention is prepared by means of oxidation polymerization. On the matrix of the conductive polymer, at least one organic sulfonate formed by an anion of an organic sulfonic acid and a cation of other than transition metals is coated. Alternatively, in the matrix of the conductive polymer, at least one organic sulfonate formed by an anion of an organic sulfonic acid and a cation of other than transition metals is included. The conductive polymer of the present invention is excellent in the conductivity, heat resistance and moisture resistance. By using it as a solid electrolyte, a reliable solid electrolytic capacitor can be prepared which is unlikely to decrease the properties when being kept in a hot and humid condition.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: January 26, 2010
    Assignee: Tayca Corporation
    Inventors: Masaaki Tozawa, Ryosuke Sugihara
  • Conductive polymer and solid electrolytic capacitor using the same
    Publication number: 20080135810
    Abstract: The conductive polymer of the present invention is prepared by means of oxidation polymerization. On the matrix of the conductive polymer, at least one organic sulfonate formed by an anion of an organic sulfonic acid and a cation of other than transition metals is coated. Alternatively, in the matrix of the conductive polymer, at least one organic sulfonate formed by an anion of an organic sulfonic acid and a cation of other than transition metals is included. The conductive polymer of the present invention is excellent in the conductivity, heat resistance and moisture resistance. By using it as a solid electrolyte, a reliable solid electrolytic capacitor can be prepared which is unlikely to decrease the properties when being kept in a hot and humid condition.
    Type: Application
    Filed: November 15, 2007
    Publication date: June 12, 2008
    Applicant: TAYCA CORPORATION
    Inventors: Masaaki Tozawa, Ryosuke Sugihara
  • Conductive polymer and solid electrolytic capacitor using same
    Publication number: 20060223976
    Abstract: The conductive polymer of the present invention is prepared by means of oxidation polymerization. On the matrix of the conductive polymer, at least one organic sulfonate formed by an anion of an organic sulfonic acid and a cation of other than transition metals is coated. Alternatively, in the matrix of the conductive polymer, at least one organic sulfonate formed by an anion of an organic sulfonic acid and a cation of other than transition metals is included. The conductive polymer of the present invention is excellent in the conductivity, heat resistance and moisture resistance. By using it as a solid electrolyte, a reliable solid electrolytic capacitor can be prepared which is unlikely to decrease the properties when being kept in a hot and humid condition.
    Type: Application
    Filed: August 6, 2004
    Publication date: October 5, 2006
    Applicant: Tayca Corporation
    Inventors: Masaaki Tozawa, Ryosuke Sugihara
  • Sandwiched thermal solution
    Publication number: 20060086493
    Abstract: A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while shielding the external surface and/or second component from the heat generated by the heat source.
    Type: Application
    Filed: October 6, 2004
    Publication date: April 27, 2006
    Inventors: Kikuo Fujiwara, Masaaki Tozawa, Gary Shives, Julian Norley, Robert Reynolds