Abstract: A method of fabricating a semiconductor device comprises steps of accommodating a substrate on which the semiconductor device is to be fabricated in a container of an electrically insulating material, forming a film of a volatile organic solvent such that the film covers substantially an entire surface of the container and the substrate accommodated therein, said step of forming the film being performed while maintaining a connection between the film of the volatile organic solvent covering the surface of the container and the ground, so that electric charges are eliminated from the substrate and the container by flowing to the ground, and removing the film of the volatile organic solvent by evaporating the solvent.

Abstract: A drive system for construction machinery in which hydraulic circuit is provided with a plurality of variable-displacement hydraulic pumps and a plurality of hydraulic actuators, each pump being connected in closed circuit to one or a plurality of the actuators via a solenoid-operated valve or valves to drive a movable member or members connected to the actuator or respective actuators when pressurized fluid is supplied to the actuator or actuators from the pump. At least one of the selected hydraulic actuators is further connected in closed circuit through a solenoid-operated valve to at least one of the hydraulic pumps other than the hydraulic pump which is connected in closed circuit to the hydraulic actuator. The hydraulic circuit means is controlled such that timing for switching the solenoid-operated valves is controlled in conjunction with the operation of the pump so as to absorb the shock which would otherwise be produced when each actuator is rendered operative and inoperative.