Abstract: One embodiment of the present invention is a hard coat film having a hard coat layer and a function layer on a substrate film, wherein the hard coat layer is formed by irradiating an acrylic acid derivative with ionizing radiation, and wherein (a) a carboxylic acid group (C?O) absorption intensity of a surface of the hard coat layer and (b) a carbon double bond (C?C) absorption intensity of the hard coat layer surface satisfy a numerical value range represented expressed by the following Expression 1, the absorption intensities being measured by infrared ray spectroscopy: 0.15?(b)/(a)?0.30 . . . Expression 1.

Abstract: One embodiment of the present invention is A hard coat film comprising a hard coat layer and a function layer on a substrate film, wherein the hard coat layer is formed by curing by irradiating an acrylic acid derivative with ionizing radiation; and (a) a carboxylic acid group (C?O) absorption intensity of a surface of the hard coat layer and (b) a carbon double bond (C?C) absorption intensity of the hard coat layer surface satisfy a numerical value range represented by the following Expression 1, the absorption intensities being measured by infrared ray spectroscopy: 0.15?(b)/(a)?0.30 . . . Expression 1.

Abstract: Provided is a BGA-type multilayer circuit wiring board which is mounted on a printed wiring board directly via a solder ball with the electrode pad for solder ball connection formed thereon and in which the electric connection reliability of the filled via connected to the electrode pad for solder ball connection is not worsened. A wiring layer is formed on both surfaces of an insulating substrate; an electrode pad for solder bump for mounting a semiconductor chip thereon is formed on one surface of the substrate via an insulating layer; and an electrode pad for solder ball for connecting the structure to a printed wiring board is formed on the other surface thereof. The electrode pad for solder ball is electrically connected to the filled via; and the filled via is disposed in the intermediate position between the neighboring electrode pads for solder ball connection.

Abstract: Provided is a BGA-type multilayer circuit wiring board which is mounted on a printed wiring board directly via a solder ball with the electrode pad for solder ball connection formed thereon and in which the electric connection reliability of the filled via connected to the electrode pad for solder ball connection is not worsened. A wiring layer is formed on both surfaces of an insulating substrate; an electrode pad for solder bump for mounting a semiconductor chip thereon is formed on one surface of the substrate via an insulating layer; and an electrode pad for solder ball for connecting the structure to a printed wiring board is formed on the other surface thereof. The electrode pad for solder ball is electrically connected to the filled via; and the filled via is disposed in the intermediate position between the neighboring electrode pads for solder ball connection.